WMSIC Electronic Components

74VHC4053AFT(BJ) 74VHC4053AFT

Model74VHC4053AFT(BJ)
PackageTSSOP16B
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 74VHC4053AFT(BJ)
Type
TOSHIBA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
74VHC4053AFT(BJ)
Electronic Component
1
Package
TSSOP16B
Electronic Component
240MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.123g
Electronic Component
1
Channel Count
3
Features
Isolated
Electronic Component
BM0264686488
Operating Temperature
40℃~+125℃
Operating Voltage
2V~5.5V
Switch
2:1
Capacitor(Con)
5.6pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

东芝74VHC4053AFT(BJ)模拟开关/多路复用器产品概述

东芝74VHC4053AFT(BJ)是一款专为高速模拟信号切换设计的CMOS多路复用器,采用3通道2:1开关架构,兼顾低损耗、宽适配性与工业级可靠性,广泛应用于消费电子、车载系统及工业控制等场景。以下从核心功能、性能参数、封装设计等维度展开详细说明。

一、核心功能与典型应用场景

该器件内置3组独立的2:1模拟开关,可同时切换3路模拟信号(或复用3组输入),核心功能是实现低失真的信号路由,典型应用包括:

  1. 消费电子信号切换:如智能手机/平板的耳机/扬声器切换、便携式设备的多音频输入(蓝牙+AUX)选择;
  2. 工业数据采集:传感器阵列的多路小信号(mV级)采集,配合-40℃~125℃宽温,适配户外监测设备;
  3. 车载信息娱乐:车载中控的FM/蓝牙/AUX音频输入切换,满足车载环境的温度与振动要求;
  4. 高速信号路由:240MHz带宽支持视频分量信号(如SDTV)、中频通信信号(几十MHz)的切换。

二、关键性能参数解析

1. 电压与功耗适配性

  • 工作电压2V~5.5V:覆盖主流系统电压(3.3V、5V),兼容低电压便携式设备(如2V供电的智能穿戴)与传统工业5V系统,无需额外电平转换;
  • CMOS工艺低功耗:静态电流极低(典型值μA级),适合电池供电的移动设备,延长续航。

2. 信号完整性表现

  • 导通电阻(Ron)24Ω:低串联电阻对小信号损耗极小(如10mV信号通过时,损耗仅~0.024mV),保证传感器、音频等弱信号的准确传输;
  • 导通电容(Con)5.6pF:低寄生电容降低高频信号的相位延迟与衰减,配合240MHz带宽,可稳定处理高速模拟信号;
  • 240MHz带宽:支持频率≤240MHz的信号切换,满足视频、中频通信等高速场景需求。

3. 环境与可靠性

  • 工作温度-40℃~+125℃:工业级宽温范围,适配极端环境(如沙漠监测、车载低温启动);
  • ESD防护:东芝VHC系列内置ESD防护(典型HBM等级±2kV),降低生产与使用中的静电损坏风险。

三、封装与系统集成优势

采用TSSOP16B薄型小尺寸封装(引脚间距0.65mm),体积仅约4.4mm×3.0mm,优势在于:

  • 高密度PCB适配:适合小型化设备(如智能手表、工业传感器模块)的紧凑布局;
  • 焊接兼容性:引脚间距符合标准回流焊工艺,量产良率高;
  • 散热效率:薄型封装利于热量散发,配合低功耗设计,无需额外散热措施。

四、品牌与替代兼容性

  • 东芝品质保障:作为半导体领域老牌厂商,东芝的CMOS工艺成熟,器件一致性好,长期可靠性经过车载(AEC-Q100)、工业级认证;
  • 兼容替代:引脚功能与其他品牌74VHC4053完全兼容,但东芝版本在宽温范围、导通电阻上更具优势,适合对环境与信号质量要求高的场景。

五、总结

东芝74VHC4053AFT(BJ)以“高速切换+低信号损耗+宽环境适配”为核心优势,解决了多通道模拟信号路由的痛点:既满足消费电子的小体积、低功耗需求,又适配工业/车载的宽温与可靠性要求。对于需要同时切换3组模拟信号的系统,是兼顾性能与成本的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.