Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP152(TPL,E(T TLP152
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
14
specifications
Core information
- Product name
- TOSHIBA TLP152(TPL, E(T
- Type
- TOSHIBA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP152(TPL,E(T
- Electronic Component
- 1
- Package
- SOIC-5-4.6mm
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- BM69413802
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP152(TPL,E(T 产品概述
1. 产品简介
TLP152(TPL,E(T) 是东芝（TOSHIBA）公司生产的一款高性能贴片光耦合器。光耦合器，亦称光隔离器，主要用于信号传递和电气隔离。TLP152在广泛的应用场合中均表现出优异的性能，尤其适用于高电压和高频率环境。
2. 主要特点
- 封装形式： TLP152采用SO-6封装，体积小巧，适合实现高密度安装，有助于节省电路板空间。
- 高性能隔离： 该光耦具有极好的电气隔离性能，能够承受高达5000Vrms的隔离电压，确保了不同电路之间有效的隔离和安全性。
- 高速传输： TLP152的传输速率可达1Mbps，适合用于快速信号传递的应用场景，满足现代通信与控制系统的需求。
- 低功耗： 低工作电流和低功耗使得TLP152非常适合功耗敏感的应用，可以延长电池供电设备的使用时间。
- 优良的线性特性： 该光耦的输入输出特性线性优良，能够精确传递信号，适合多种控制和数据通信系统。
3. 主要应用
TLP152的应用领域十分广泛，主要包括：
- 电源管理：用于开关电源的反馈控制电路，提供良好的隔离和安全性。
- 工业自动化：在传感器、执行器等设备中，通过光耦实现信号隔离和数据传输，提高系统的抗干扰能力。
- 数据通信：在串口通信、CAN总线等领域，使用TLP152可以有效地将数据从一个电路传输到另一个电路，保证数据的完整性和系统的稳定性。
- 家电控制：在智能家居和家电产品中，TLP152用于控制面板与主电路之间的隔离，保护用户安全。
4. 规格参数
以下是TLP152的主要技术参数：
- 最大工作电压 (V_r): 30V
- 输出电流 (I_o): 50mA
- 输入电流 (I_f): 20mA
- 传输延迟时间 (t_plh/t_phl): 100μs（典型值）
- 工作温度范围: -40°C至+100°C
- 绝缘电阻: 高达10^12Ω
5. 设计注意事项
在使用TLP152时，设计师需注意以下几点：
- 电源设计：确保光耦的输入和输出电路供电设计合理，避免过载。
- PCB布局：在PCB布局时，应避免信号线的交叉和过近布局，以减少干扰和噪声影响。
- 热管理：在长时间高功率运行条件下，应考虑热散设计，确保光耦不被过热损坏。
- 输入输出匹配：输入和输出部件的特性需匹配，以保证光耦的最佳驱动效果。
6. 结论
作为一款高性能的光耦合器，TLP152(TPL,E(T)在提供高效信号隔离和传输的同时，确保了系统的安全与可靠性。其独特的设计和卓越的性能使其在各类电子应用中成为理想选择。无论是在电力系统、工业自动化还是消费电子产品中，TLP152都能够发挥其价值，为设计师提供创新的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
