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TLP748J(F) TLP748J
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TOSHIBA TLP748J(F)
- Type
- TOSHIBA
- Unit
- Electronic Component
- Minimum package
- 1000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP748J(F)
- Electronic Component
- 1
- Package
- 6-DIP
- Electronic Component
- Thyristor Output Optocoupler
- Electronic Component
- 0.62g
- Electronic Component
- 1
- Channel Count
- 1
- Staticdv / dt
- 5V/us
- Electronic Component
- BM0264392151
- Operating Temperature
- 40℃~+100℃
- Current
- 25mA
- Load Voltage
- 600V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP748J(F) 产品概述
一、概述
TLP748J(F) 是东芝（TOSHIBA）推出的一款单通道可控硅输出光耦（光隔离可控硅），采用 6 引脚 DIP 封装。器件通过发光二极管（LED）驱动内部单向可控硅（SCR），实现输入与高电压侧负载的电气隔离与控制。没有过零功能，可在任意电压相位触发导通，适用于需要相位控制或脉冲触发的场合。
二、主要规格
- 通道数：1 通道
- 可控硅类型：单向 SCR（可控硅）
- 负载耐压：600 V（额定）
- 输出电流（It(rms））：150 mA
- LED 正向压降（Vf）：约 1.15 V（IF=25 mA）
- LED 正向电流（IF）：典型 25 mA（触发驱动参考）
- 静态 dv/dt：5 V/µs（需注意误触发）
- 隔离耐压（Vrms）：4 kV
- 工作温度范围：-40 ℃ ～ +100 ℃
- 封装：6-DIP
三、关键特性
- 单向可控硅输出，结构简单、体积小，适合直流开关或交流半波控制。
- 无过零电路，可在任意相位触发，实现相位角调光、相位控制等功能。
- 高隔离电压（4 kVrms），便于实现低压控制与高压负载之间的安全隔离。
- 相对较低的静态 dv/dt（5 V/µs），在高 dv/dt 环境下需采取抑制措施以防误触发。
四、使用要点
- 驱动侧：推荐 LED 驱动电流接近 20～25 mA 以确保可靠触发；通过限流电阻与驱动器或 MCU 输出串联。
- 输出侧：由于为单向 SCR，适合 DC 开关或 AC 半波控制场景；若用于交流全波控制需配合两只反向并联或桥式电路。
- 抑制建议：静态 dv/dt 较低，建议在负载侧并联 RC 抑制（snubber）或使用合适的阻容网络与熔断元件，避免误触发与过冲。
- 散热与额定：输出 It(rms) 为 150 mA，设计时考虑平均功耗与封装散热能力，避免长期超载。
五、典型应用
- 低功率直流负载开关（电磁阀、继电器线圈的直流控制）
- 灯光调光、相位角控制的交流半波调节（与电路设计配合）
- 隔离的检测与触发电路，用于把小信号控制侧安全地驱动高压负载
- 工业控制、家电小功率控制模块等
六、封装与可靠性
TLP748J(F) 提供 6-DIP 封装，便于插装与人工插件维修。器件在 -40 ℃ 到 +100 ℃ 的工作温度范围内保持性能稳定。为保证长期可靠性，建议遵循厂商的封装温升与焊接工艺参数，并在高 dv/dt 环境下增加抑制与滤波措施。
七、选型与订购建议
选型时确认负载电压、平均与脉冲电流是否在器件额定范围内；若需隔离更高电压或更大导通电流，应考虑更高规格的器件或使用并联/并联+散热设计。订购时注意封装形式（6-DIP）与是否带后缀（F 表示特殊选项），并向供应商索取完整数据手册以核对引脚定义与最大额定值。
如需具体电路示例或和常见场景（例如交流相位控制电路、snubber 网络设计）的详细设计建议，我可以进一步提供。
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