WMSIC Electronic Components

TC7S08F,LF(T TC7S08F

ModelTC7S08F,LF(T
PackageSOT-353-5
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
TOSHIBA TC7S08F, LF(T
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC7S08F,LF(T
Electronic Component
1
Package
SOT-353-5
Electronic Component
Logic Gate
Electronic Component
0.092g
Electronic Component
1
Electronic Component
BM0000035491
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC7S08F,LF(T) 产品概述

一、产品概述

**TC7S08F,LF(T)**是东芝(TOSHIBA)公司推出的一款高性能逻辑门,封装形式为SOT-353-5。这款产品为四个2输入与门(AND gate)的组合,采用高效的CMOS技术制造,具有低功耗和高噪声容忍度的特点。TC7S08F是非常适合现代数字电路设计的元器件,广泛应用于各种电子设备中。

二、技术规格

  1. 逻辑功能:TC7S08F提供四个具有两输入的与门功能。它可以实现逻辑运算"Y = A · B",即只有在A和B均为高电平时,输出Y才为高电平。

  2. 工作电压范围:该器件支持广泛的工作电压范围,一般在2.3V到5.5V之间。这样的特性使得TC7S08F可以与多种电系统相兼容。

  3. 低功耗设计:得益于CMOS工艺,TC7S08F的静态功耗极低,非常适合于需要长时间工作的便携式设备。

  4. 工作温度范围:器件可以在-40°C至+85°C的温度范围内稳定工作,适合各种工作环境。

  5. 开关速度:其开关速度较快,能够支持高速逻辑操作,这对于一些需要快速响应的处理来说尤为重要。

  6. 封装尺寸:SOT-353-5封装小巧轻便,适合空间受限的应用,如手机、平板、便携式电子设备等。

三、应用领域

TC7S08F的设计使得其在多种应用领域中具有广泛的适用性,主要包括但不限于以下几个方面:

  1. 消费电子:在手机、相机、智能家居设备等消费电子产品中广泛使用,用于实现逻辑运算。

  2. 工业控制:在各类工业自动化设备中,TC7S08F可以用于状态检测、信号处理等方面。

  3. 汽车电子:随着汽车电子化的普及,TC7S08F也逐渐被应用到汽车控制系统中,以进行各种电子控制任务。

  4. 通信设备:在通信设备中,TC7S08F可用于实现数据传输条件下的逻辑判断,提升信号处理的效率。

四、优点

  1. 高噪声容忍度:TC7S08F具有良好的噪声特性,使其在工业环境中也能稳定运行。

  2. 接口兼容性:器件兼容TTL和CMOS逻辑电平,能够方便地与其他电子元件互联。

  3. 可靠性和耐用性:其封装和设计经过严格测试,能够经受高温、低温和电气干扰等恶劣工作环境的考验。

  4. 简易集成:由于其小型化的封装,TC7S08F可轻松集成在各种电路设计中,节约电子设备的物理空间。

五、结论

TC7S08F,LF(T)是东芝公司设计的一款卓越与门逻辑器件。凭借着低功耗、高速度、广泛的适用电压和工作温度范围,它为电子设计工程师提供了灵活的选择。无论是在消费电子、工业控制还是汽车电子等领域,这款组件都展现出其卓越的性能和良好的可靠性。通过选用TC7S08F,设计师可以高效地实现复杂逻辑功能,提高产品的整体性能。随着未来智能设备的进一步发展,TC7S08F将继续在数字电路中发挥重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.