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2SC2713-GR,LF(T 2SC2713
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA 2SC2713-GR, LF(T
- Type
- TOSHIBA
- Minimum package
- 3000
Technical parameters
- Electronic Component
- TOSHIBA
- Electronic Component
- 2SC2713-GR,LF(T
- Electronic Component
- 1
- Package
- TO-236-3
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.048g
- Electronic Component
- 1
- Electronic Component
- BM0000285008
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 3000
- Collector Current(Ic)
- 100mA
- Current (h FE)
- 200@2mA,6V
- Voltage(Vebo)
- 5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：2SC2713-GR,LF(T) NPN 三极管
概述
2SC2713-GR,LF(T) 是一款由东芝公司（TOSHIBA）生产的 NPN 型三极管，封装类型为 SOT23，具备优异的电气性能和广泛的应用范围。该器件的主要参数包括最大功耗150mW，最大耐压120V，以及最大集电极电流为100mA。这使得 2SC2713-GR,LF(T) 能够适应多种电子电路的需求，无论是在信号放大、开关控制还是其他现代电子设备中。
电气特性
- 额定功率：2SC2713-GR,LF(T) 的最大功率为150mW，这使得它适用于小功率放大和开关应用。
- 最大集电极电流：该三极管能够承受最大100mA的集电极电流，这对于低功耗设备和小型电源电路至关重要。
- 耐压：其最大耐压为120V，这表明该器件能够在高电压环境下稳定运行，增加了其适用范围。
封装和尺寸
2SC2713-GR,LF(T) 采用了 SOT23 封装，这是一种小型化的表面贴装封装，适合集成于高密度电路板中。SOT23 封装的尺寸小、重量轻，使得它能够在现代电子产品中节省空间并减少整体重量，同时提供可靠性能。
应用场景
2SC2713-GR,LF(T) 的广泛应用使其成为许多电子设计的理想选择，具体应用包括：
信号放大器：由于其良好的增益特性，2SC2713-GR,LF(T) 可用于音频和视频信号放大电路，增强信号质量。
开关控制：在开关电源、电机驱动等电路中，该三极管可以作为开关元件，有效控制电流流向，通过控制基极电流实现对负载的精准监测和控制。
树状电路：由于其高耐压特性，2SC2713-GR,LF(T) 可应用于各种电压分配和信号分配电路，以 تحسين 其抗电涌能力和稳定性。
逻辑电路：作为小信号放大器和开关，2SC2713-GR,LF(T) 也广泛应用于数字电路中，能够良好工作于逻辑状态转换阶段。
性能优势
高耐压和高集电极电流：2SC2713-GR,LF(T) 提供了优越的耐压能力和集电极电流承载能力，使得它能够承受更高的工作电压和负载，增加了电路设计的灵活性。
小型化设计：SOT23 封装不仅小巧，还利于自动化贴装，提升了生产效率，降低了生产成本。
稳定性和可靠性：作为知名品牌东芝的产品，2SC2713-GR,LF(T) 提供了良好的工艺稳定性及可靠性，能够满足严格的工业和消费应用要求。
结论
综合来看，2SC2713-GR,LF(T) 是一款适应广泛、电气性能良好的 NPN 三极管，其设计允许它在多种应用中稳健运行。无论是在个人消费电子、大型工业设备，还是在高级通信装置中，这款三极管都能提供必要的特性与性能支持。其高耐压、适量的功耗、良好的封装形式，确保了它在未来技术发展的多样性需求中，依然是一款备受青睐的选择。
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