WMSIC Electronic Components

TLP183(BL-TPL,E(T TLP183

ModelTLP183(BL-TPL,E(T
PackageSOIC-4
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP183(BL-TPL, E(T
Type
TOSHIBA
Minimum package
3000

Technical parameters

Electronic Component
TOSHIBA
Electronic Component
TLP183(BL-TPL,E(T
Electronic Component
1
Package
SOIC-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0000285717
Operating Temperature
55℃~+125℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
Output Channel Count
1
(tr)
2us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP183(BL-TPL,E(T) 产品概述

一、产品简介

TLP183(BL-TPL,E(T) 是东芝(TOSHIBA)公司推出的一款高性能晶体管输出光耦(光耦合器),封装形式为 SOP4(小型四引脚表面贴装封装)。作为一种重要的电子元器件,光耦合器在现代电子电路中扮演着至关重要的角色,通过光信号的方式实现电气隔离,保护电路,提高系统的稳定性和安全性。

二、产品特点

  1. 光隔离特性: TLP183 提供高电压隔离(通常为 2000Vrms),保护下游电路免受高电压或脉冲干扰,对于需要安全隔离的应用非常适合。

  2. 代码输出设计: 该光耦配备了一个高增益的晶体管输出,能够快速执行信号的开关操作,使用者可以通过控制输入端来高效地调节输出端的状态。

  3. 小型化封装: SOP4 封装不仅节省空间,占用的PCB面积小,还支持表面贴装技术(SMT),方便实现自动化生产,降低生产成本。

  4. 宽工作温度范围: TLP183 在较宽的工作温度范围内(-40°C 到 100°C)依然能够保持稳定的性能,适用于多种环境和应用。

  5. 低功耗特性: 较低的输入电流,能够有效减少整体电源的消耗,提升系统的能效。

三、主要应用场景

TLP183 由于其优越的性能和高度的可靠性,广泛应用于以下领域:

  1. 工业自动化:在各种工业控制系统中,TLP183 被用作传感器的信号隔离、迅速传输和电源管理等,保障设备的正常运行与安全。

  2. 消费电子:用于家用电器、商业设备等,以实现人机界面的隔离和动态信号传递,提高安全性和操作灵活性。

  3. 通信设备:在网络基础设施设备中,光耦能够有效隔离信号,确保数据的传输完整性和系统的稳定性。

  4. 电源管理:在开关电源(SMPS)等电源转换器中,光耦合器用于反馈控制,以实现更加稳定和可靠的输出。

  5. 医疗设备:在医用电子设备中,使用光耦能够减少对用户的电气风险,确保患者的安全。

四、技术参数与规格

TLP183 的技术参数对于设计工程师尤为重要。以下是一些关键指标:

  • 输入电压(Vf):1.2-1.4V(典型值)
  • 输出电压(Vo):最大 50V
  • 输出电流(Io):最大 50mA
  • 传输延迟:通常在 0.1ms 以下
  • 电气隔离强度:2000Vrms
  • 工作温度范围:-40°C 至 100°C

五、结论

作为东芝公司的一款高性能光耦合器,TLP183(BL-TPL,E(T) 以其卓越的电气隔离性能、灵活的应用场景及稳健的工作特性,在市场中得到了广泛认可。无论是在工业自动化、消费电子、通信设备、Power Management 还是医疗设备领域,它都能够提供可靠的解决方案,是现代电子设计中不可或缺的元件之一。选择适合的光耦合器,不仅可以提高产品的安全性和可靠性,还能提升整个系统的性能,为客户创造更大的价值。

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