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2SA1162-Y(TE85L,F) 2SA1162
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA 2SA1162-Y(TE85L, F)
- Type
- TOSHIBA
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- 2SA1162-Y(TE85L,F)
- Electronic Component
- 1
- Package
- SOT-346
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0258553242
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 80MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SA1162-Y(TE85L,F) 产品概述
一、概述
2SA1162-Y(TE85L,F) 为东芝（TOSHIBA）出品的小功率PNP硅晶体管，采用紧凑的SOT-346封装，面向便携式电子设备与一般小信号放大/开关场合。此器件在保证低电流泄露和较高频率响应的同时，具备良好的线性放大特性和低饱和压降，适合对空间与功耗有严格限制的应用。
二、主要特性（关键参数）
- 晶体管类型：PNP
- 最大集电极电流 Ic：150 mA
- 集射极击穿电压 Vceo：50 V
- 耗散功率 Pd：200 mW（封装限值，工作时需按温度降额）
- 直流电流增益 hFE：70 (测量条件 2 mA、6 V)
- 特征频率 fT：80 MHz（适用于高频小信号放大）
- 集电极截止电流 Icbo：100 nA（低漏电流，有利于高阻电路稳定）
- 集电极饱和电压 VCE(sat)：约100 mV（在规定测试电流下，表现出低饱和电压）
- 工作温度范围：-55 ℃ ~ +150 ℃
三、性能与优势
- 高频性能：fT=80 MHz 支持中高频放大，适用于RF前级、视频或高速模拟信号链的设计。
- 低漏电流与低VCE(sat)：Icbo小（100 nA）与低饱和电压（~100 mV）有助于降低静态功耗并提高开关效率。
- 紧凑封装：SOT-346 占板面积小，便于高密度布局与便携设备使用。
- 宽温度范围：-55℃至+150℃适用于工业级或高温环境下的应用，但功耗需随环境温度降额。
四、典型应用
- 小信号放大器与前置放大（音频/视频小信号）
- 低功耗开关电路与电源管理的驱动/接口电路
- 无线通信中的中低频放大单元
- 便携式、手持及消费类电子产品中替代通用PNP晶体管
五、设计与使用建议
- 功耗管理：Pd 仅 200 mW，PCB布线应考虑散热与热阻，必要时采用散热铜箔扩大散热面积，并按原厂数据手册进行温度降额计算。
- 偏置与线性区工作：高增益 hFE 在低电流工况下表现良好，适合小信号放大；若用于开关，应确认在规定测试电流下的VCE(sat)与驱动电平匹配。
- ESD 与装配：SOT-346为小型封装，装配与回流焊时应遵循制造商的温度曲线及静电防护规范，以免损伤晶体管。
- 引脚与布局：SOT-346 封装引脚尺寸与脚位排列影响寄生电阻/电感，射频设计时应缩短引线并做好接地处理。
六、结论
2SA1162-Y(TE85L,F) 是一款面向通用小信号放大与低功耗开关的PNP晶体管，兼顾频率响应与低漏电特性，适用于空间受限且需良好线性与低损耗的电子系统。为确保可靠性，请在设计中重视功耗降额、热管理及封装布局，并参照东芝原厂规格书完成详细参数验证与应用确认。
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