WMSIC Electronic Components

TBD62783AFG(Z,EL) TBD62783AFG

ModelTBD62783AFG(Z,EL)
PackageSOP-18-300mil
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TBD62783AFG(Z, EL)
Type
TOSHIBA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TBD62783AFG(Z,EL)
Electronic Component
1
Package
SOP-18-300mil
Type
MOS
Electronic Component
Darlington Transistor Array
Electronic Component
0.6g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0227798155
Operating Temperature
40℃~+85℃
Current(Ir)
1uA
(Vf)
2V
Current(on)
0.1mA
Current(off)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

东芝TBD62783AFG(Z,EL)八路功率电子开关产品概述

一、产品核心定位与品牌背景

TBD62783AFG(Z,EL)是东芝(TOSHIBA)推出的八路集成功率电子开关,属于功率驱动类半导体器件,专为多路独立开关控制场景设计。东芝作为全球老牌半导体厂商,拥有数十年功率器件研发经验,该型号延续了其高可靠性、宽温适应性的核心优势,适用于工业、消费电子等多领域的负载切换需求。

二、关键电气参数详解

该器件的核心参数直接定义了应用边界,具体特性如下:

  • 通道数:8路独立开关,可同时控制8组负载,无需额外扩展多路器件,简化电路设计;
  • 最大输入电压(VI):30V,控制端兼容5V/12V/24V等常见逻辑电平,适配多数MCU或PLC输出;
  • 工作温度范围:-40℃~+85℃,符合工业级标准,可在低温户外或高温车间稳定工作;
  • 输入电流特性:导通(on)0.1mA、关断(off)1uA——导通电流低,减少控制端功耗;关断漏电流极小,避免负载误触发;
  • 正向压降(Vf):2V,导通时的压降需结合负载电流计算损耗(损耗=负载电流×2V),适用于小功率负载;
  • 反向电流(Ir):1uA,反向漏电流极低,反向应用时可抑制漏电流对负载的影响。

三、封装与物理特性

该器件采用SOP-18-300mil封装:

  • SOP(小外形封装)为表面贴装结构,适合自动化贴片生产,降低组装成本;
  • 18引脚布局清晰,便于电路布线与调试;
  • 300mil(约7.62mm)封装尺寸紧凑,节省PCB空间,适配小型化电子设备。

四、典型应用场景

结合参数特性,该器件的典型应用包括:

  1. 多路LED驱动:8路可驱动指示灯、显示阵列等小功率LED,30V输入兼容多串LED电压需求;
  2. 继电器线圈控制:同时控制8个继电器,关断漏电流极小,避免继电器误吸合,适合工业控制;
  3. 小型电机/电磁阀驱动:适配低功率微型电机(如玩具电机)、电磁阀,宽温特性满足工业现场需求;
  4. 消费电子多路切换:智能家居的多路电源分配、音频切换等,集成设计减少元件数量;
  5. 工业I/O扩展:PLC扩展模块的多路执行器控制,宽温范围适应车间环境。

五、性能优势与设计注意事项

5.1 核心优势

  • 集成度高:单芯片集成8路开关,降低电路复杂度与故障风险;
  • 宽温可靠:工业级温度范围,适合 harsh环境;
  • 低功耗:导通电流仅0.1mA,关断漏电流1uA,延长电池设备续航;
  • 品牌保障:东芝制造,质量稳定,可追溯性强。

5.2 设计注意事项

  • 过压防护:控制端电压不得超过30V,需增加TVS管等过压保护;
  • 功率损耗:导通压降2V,需根据负载电流计算损耗(如100mA负载损耗200mW),确保散热;
  • 反向应用:反向漏电流1uA,若需反向导通需评估对负载的影响;
  • 焊接规范:SOP封装需控制焊接温度与时间,避免过热损坏。

该器件凭借集成度、宽温特性与低功耗优势,成为多路开关控制场景的实用选择,适用于从消费电子到工业控制的多领域设计。

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