WMSIC Electronic Components

TLP2748(D4-TP,E(T TLP2748

ModelTLP2748(D4-TP,E(T
PackageSO-6L-300mil
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP2748(D4-TP, E(T
Type
TOSHIBA
Minimum package
1500 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP2748(D4-TP,E(T
Electronic Component
1
Package
SO-6L-300mil
Electronic Component
Logic Output Optocoupler
Electronic Component
0g
Electronic Component
1
Channel Count
1
Electronic Component
BM0233600736
Operating Temperature
40℃~+110℃
Operating Voltage
4.5V~30V
Type
DC
tp HL
120ns
tp LH
120ns
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP2748(D4-TP,E(T) 产品概述

TLP2748 是东芝(TOSHIBA)推出的一款单通道逻辑输出光耦,专为工业与消费类电子中对直流逻辑信号进行安全隔离和电平转换的场合设计。器件采用 SO-6L-300mil 封装,工作电压范围宽(4.5V ~ 30V),单通道隔离电压高达 5kVrms,工作温度覆盖 -40℃ 到 +110℃,在抗干扰、可靠性和系统集成上具有明显优势。以下从特性、典型电气参数、应用场景和设计注意事项等方面做简要说明,方便工程师快速评估与采用。

一、主要特性与性能亮点

  • 逻辑输出型光耦,用于将输入直流/逻辑信号与输出侧电路电气隔离;
  • 输入类型:DC(LED 驱动);输入门槛电流(I_F(H))约 1.6 mA,易被低电流逻辑驱动器驱动;
  • 输出工作电压范围宽:DC 4.5V 至 30V,适配 TTL/CMOS/5V、12V、24V 工业总线等不同电平系统;
  • 隔离电压(Vrms)高达 5 kV,满足多数工业控制与电源反馈的安全与抗干扰要求;
  • 传播延迟:tpLH ≈ 120 ns,tpHL ≈ 120 ns,两方向延迟均衡,有利于降低上、下沿畸变;
  • 单通道器件,封装为 SO-6L-300mil,便于电路板布局与焊接;
  • 宽工作温度范围:-40℃ 至 +110℃,适合工业级环境。

二、电气性能与系统意义

  • 输入侧:器件以 LED 为输入元件,指定的输入阈值电流 I_F(H)=1.6 mA 表明只需较小驱动电流即可保证输出逻辑有效。这对 MCU、FPGA 或低功耗逻辑直接驱动非常友好,可降低整体功耗。
  • 输出侧:输出为逻辑兼容的开集电极/集电极输出(常见于逻辑输出型光耦),需要外部上拉电阻接至所需的 VCC(4.5–30V)。宽电压范围允许在 5V/12V/24V 系统中直接采用同一型号器件。
  • 传播延迟 120 ns 量级说明该器件适用于中速数字信号隔离(几十 kHz 至几 MHz 级别),延迟对称意味着脉冲占空比在隔离传输中变化小,适合定时、计数与双向控制信号的传输。

三、典型应用场景

  • 工业控制信号隔离:PLC 与外设、传感器、驱动器之间的控制命令隔离;
  • 开关电源与电机驱动反馈:将初级或噪声大的测量/控制信号隔离至二次控制回路;
  • 微控制器接口保护:在电磁环境复杂或地线差异大的场合保护 MCU 输入/输出;
  • 通讯信号隔离:隔离数字总线或串口信号,防止地环路和共模干扰;
  • 测量与数据采集:在高压或大功率场合进行安全的信号采样与传输。

四、设计与使用建议

  • 输入限流电阻:按公式 R = (V_drive - V_F) / I_F,选择合适安全裕量的电阻。若参考 LED 正向压降 V_F ≈ 1.2V(典型值,具体以器件数据手册为准),在 5V 驱动下,保证 I_F ≥ 1.6 mA 时 R ≈ (5 - 1.2) / 1.6mA ≈ 2.375 kΩ,可选 2.2kΩ~2.7kΩ 级别并加适当裕量。
  • 输出上拉电阻:根据目标 VCC 与所需电平/带载能力计算上拉电阻,既要保证开漏饱和时电压跌落在容许范围内,也要兼顾上拉和器件切换速度的平衡;典型情况下 4.7kΩ 到 47kΩ 是常见选择,频率更高或需更快上升沿时采用较小阻值。
  • 布局及隔离:为发挥 5kVrms 隔离能力,PCB 布局应保证输入与输出侧的走线、焊盘之间有足够的爬电距离与隔离区,同时避开大电流回路与强电磁干扰源。
  • 环境与热管理:器件能在 -40℃ 到 +110℃ 工作,但在高温或高功率应用中注意散热及 LED 驱动电流不要长期过大以延长可靠性。

五、封装与可靠性

  • 封装:SO-6L-300mil,便于表面贴装与自动化装配;适用于批量生产的 SMT 工艺。封装形式利于在紧凑的 PCB 布局中实现光电隔离功能。
  • 可靠性:高隔离电压与宽温度范围使其适合工业级应用。在高共模干扰环境下,可以有效保护低电压控制侧器件并延长系统寿命。

总结:TLP2748(D4-TP,E(T) 是一款面向中高速数字隔离场合的逻辑输出光耦,凭借低输入阈值电流、宽输出电压范围、高隔离电压与工业级温度范围,能在工业控制、电源反馈与微控制器接口保护等领域提供稳定、可靠的信号隔离解决方案。使用时请参考东芝官方数据手册以获取完整电气参数与引脚定义,并按照推荐的 PCB 布局与限流/上拉方案实施。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.