WMSIC Electronic Components

TLP5701(D4-TP,E TLP5701

ModelTLP5701(D4-TP,E
Package6-SO
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TLP5701(D4-TP, E
Type
TOSHIBA
Unit
Electronic Component
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP5701(D4-TP,E
Electronic Component
1
Package
6-SO
Electronic Component
Logic Output Optocoupler
Electronic Component
0.359g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
20kV/us
Features
Electronic Component
Electronic Component
BM0258874093
Operating Temperature
40℃~+110℃
Operating Voltage
10V~30V
Type
DC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP5701 (D4-TP, E) 产品概述

一、产品简介

TLP5701 为东芝(TOSHIBA)出品的一款单通道隔离驱动耦合器(Driver Coupler),型号标识为 X36 PB-F DRIVER COUPLER 0.6A,封装为 6-SO。器件以直流输入驱动,集成光电或磁隔离机制,实现逻辑侧与功率侧的电气隔离与驱动放大,适用于需要中等电流驱动与高共模瞬态抗扰度的场合。

二、主要参数与电气特性

  • 输入类型:DC;工作电压范围:10V ~ 30V
  • 隔离耐压:5 kVrms(器件两侧实现可靠的电气绝缘)
  • 共模瞬态抗扰度(CMTI):25 kV/μs,适应快速上升沿与高 dV/dt 环境
  • 通道数:1;输出驱动能力:0.6 A(典型驱动等级)
  • 工作温度:-40°C ~ +110°C
  • 传播延迟:tpLH ≈ 500 ns,tpHL ≈ 500 ns(上升/下降延时对称,适合中速控制)
  • 输入阈值电流(FH):≈ 5 mA;典型正向电流 If:10 mA,正向压降 Vf ≈ 1.57 V,反向耐压 Vr ≈ 5 V
  • 功耗:耗散功率 Pd ≈ 80 mW
  • 封装:6-SO,便于 PCB 贴装与散热设计

三、典型应用场景

  • 电机驱动与逆变器的栅极驱动隔离,需高 CMTI 以抑制电机驱动侧噪声耦合
  • 开关电源(SMPS)、有源整流与功率因数校正电路的隔离驱动
  • 可编程逻辑控制器(PLC)、工业通信接口与安全隔离信号链路
  • 需要中等开关速度与稳健隔离的现场总线与传感器接口

四、封装、热管理与可靠性

6-SO 封装利于自动化贴装,但在高温或高占空比工作下需关注热沉与 PCB 散热路径。器件支持 -40°C 至 +110°C 工作温度,隔离等级 5 kVrms 满足工业级绝缘需求。布局时保持充足爬电与气隙距离,并按规范做隔离测试与老化验证。

五、选型与使用注意事项

  • 确保供电与信号电平在 10–30V 与输入阈值范围内;驱动电流按 If 与 Vf 估算必要输入源能力。
  • 对于高 dV/dt 环境,25 kV/μs CMTI 提供良好抗扰度,但仍需合理接地、屏蔽与差分布线以降低干扰。
  • 输出端常见需配合限流或栅极电阻、吸收器件(RCD、TVS)以保护器件免受电感反射与过压冲击。
  • 在高温或高功率密度场合,评估 Pd 与封装热阻,必要时增加铜箔面积或散热片。
  • 通过实际系统测试验证传播延迟与时序匹配,确保开关时序与死区控制满足系统安全要求。

总结:TLP5701(D4-TP, E)为一款面向工业与电力电子的单通道隔离驱动器,兼顾较高隔离耐压与优良 CMTI,适用于对隔离可靠性与中等驱动能力有要求的场合。在具体设计中注意热管理、抗干扰与保护元件配置,即可发挥其稳定驱动与隔离功能。

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