WMSIC Electronic Components

TLP291-4(V4GBTPE(T TLP291

ModelTLP291-4(V4GBTPE(T
PackageSOP-16-4.4mm
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP291-4(V4GBTPE(T
Type
TOSHIBA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP291-4(V4GBTPE(T
Electronic Component
1
Package
SOP-16-4.4mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0228731369
Operating Temperature
55℃~+110℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
170mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP291-4 (V4GBTPE(T)) 产品概述

一、概述

TLP291-4 是东芝(TOSHIBA)出品的晶体管输出型光耦合器,输入为直流驱动的发光二极管(LED),输出为光电三极管。器件采用 SOP-16(4.4mm 间距)封装,多通道排列,专为需要电气隔离且保留模拟开关特性的场合设计。凭借 2.5kVrms 的高隔离耐压和较宽的工作温度范围(-55℃~+110℃),适合工业控制、电源反馈与信号隔离等应用。

二、主要性能参数

  • 输入正向压降(Vf):典型 1.2V
  • 最大正向电流(If):50mA
  • 输出类型:光电三极管,最大输出电流 50mA
  • 集电极-发射极饱和电压(VCE(sat)):典型 400mV(在指定工作点)
  • 直流反向耐压(Vr,LED):5V
  • 负载电压(输出侧允许电压):最高 80V
  • 隔离电压(Vrms):2.5kV
  • 上升/下降时间:tr ≈ 2µs,tf ≈ 3µs(适合中低速开关)
  • 电流传输比(CTR):最小 50%,最大/饱和值 400%(注意存在较大散布)
  • 总功耗(Pd):170mW
  • 工作温度:-55℃ ~ +110℃
  • 封装:SOP-16-4.4mm(多通道集成,利于 PCB 布局与匹配)

三、典型应用场景

TLP291-4 适用于需要隔离传输直流或脉冲信号的场景,包括但不限于:

  • 工业控制信号隔离(PLC、驱动器)
  • 开关电源或电池管理系统中的检测/反馈回路
  • 微控制器与高电位电路之间的接口隔离
  • 传感器前端的噪声抑制与共模抑制

四、设计与使用注意事项

  1. CTR 散布较大(50% ~ 400%),设计时应按最小 CTR 进行保守计算,或做必要的通道标定与调试。
  2. 输出为光电三极管,通常需要外接上拉电阻;上拉电压不得超过 80V,且根据最大输出电流选择合适阻值以避免超过 VCE(sat) 或器件 Pd。
  3. 控制 LED 正向电流 If 不超过 50mA,且考虑平均功耗与脉冲限制,避免长时间高 If 导致热失效。
  4. 响应时间为微秒级,适合中低速开关或脉冲隔离,但非高速数字光耦,应避免用于 MHz 级应用。
  5. 在高温或大电流工况下注意功耗限值(Pd 170mW),必要时在 PCB 布局上预留散热与热阻管理。
  6. 保持输入侧与输出侧的爬电距离与绝缘设计,以发挥 2.5kVrms 的隔离能力。

五、封装与可靠性

SOP-16-4.4mm 的多通道封装有助于信号配对与 PCB 布局统一,便于批量生产与通道间一致性管理。器件的宽温度范围及高隔离电压使其在工业环境中具有较高的可靠性,但在实际应用中仍需注意热管理、过压保护与长期偏置退化问题。

总结:TLP291-4(V4GBTPE(T))是一款面向工业级信号隔离的晶体管输出光耦,兼顾高隔离、电流驱动能力与中等速率响应,适用于多通道隔离场合。正确的电流限流、上拉设计与热管理是保证系统稳定性的关键。

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