WMSIC Electronic Components

TLP2309(V4-TPL,E(T TLP2309

ModelTLP2309(V4-TPL,E(T
PackageSO-5-4.6mm
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP2309(V4-TPL, E(T
Type
TOSHIBA
Minimum package
3000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP2309(V4-TPL,E(T
Electronic Component
1
Package
SO-5-4.6mm
Electronic Component
Logic Output Optocoupler
Electronic Component
0g
Electronic Component
1
Channel Count
1
Electronic Component
Logic Output Optocoupler
Electronic Component
BM0257377540
Operating Temperature
40℃~+110℃
Power Supply Voltage
2.7V~20V
Type
DC
Voltage(rms)
3.75kV
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP2309 (V4‑TPL, E(T)) — 逻辑输出光耦产品概述

一、产品简介

TLP2309 是东芝(TOSHIBA)推出的单通道逻辑输出光耦,面向需要电气隔离且响应速度较高的数字接口场合。器件输入为 DC 驱动,输出为逻辑电平,可直接与下游 TTL/CMOS 或微控制器电路配合工作。标准封装为 SO‑5(4.6mm 宽),便于电路板安装与批量生产。

二、主要电气参数与性能亮点

  • 隔离电压(rms):3.75 kV,满足多种中低压系统的基本安全隔离要求。
  • 共模瞬变抗扰度(CMTI):15 kV/µs,适合高速开关环境(如逆变器、驱动器)中强烈 dv/dt 条件下保持可靠传输。
  • 工作电源电压:2.7 V ~ 20 V,支持从低压逻辑到较高电平驱动的宽范围应用。
  • 工作温度范围:-40 ℃ ~ +110 ℃,适合工业级温度需求。
  • 通道数:1,输入类型:DC,便于点对点隔离设计。

三、典型应用场景

适用于电力电子驱动接口(IGBT/MOSFET 驱动前端隔离)、开关电源控制信号隔离、微控制器与高电位电路之间的数字隔离、工业自动化与测试测量设备等需要高速抗扰、可靠隔离的场合。

四、设计与使用建议

  1. 输出侧请靠近 IC 放置旁路电容并做好电源滤波,降低抖动与扰动。
  2. 针对高 dv/dt 场景,保持输入与输出的接地分离,增加共模干扰抑制元件(如共模电感或滤波电容)。
  3. 选择合适的输入限流电阻以匹配驱动器电平并控制开关速度,平衡响应速度与 EMI。
  4. 留意 PCB 的爬电距离与通孔封阻,以充分发挥 3.75 kV 隔离性能。

五、封装与可靠性

SO‑5(4.6mm)小型引脚封装适合通用 PCB 布局,工业级温度和高 CMTI 指标使其在恶劣电磁环境下保持稳定工作。推荐在产品认证与安规要求下进行系统级测试验证隔离与耐压能力。

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