WMSIC Electronic Components

TLP185(GR-TPR,E(T TLP185

ModelTLP185(GR-TPR,E(T
PackageSOP-4-2.54mm
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TLP185(GR-TPR, E(T
Type
TOSHIBA
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP185(GR-TPR,E(T
Electronic Component
1
Package
SOP-4-2.54mm
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
5us@2mA,100Ω
Electronic Component
9us@2mA,100Ω
Voltage
5V
Electronic Component
Transistor Output Optocoupler
Electronic Component
BM0258831723
Operating Temperature
55℃~+110℃
Voltage
1.25V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP185 晶体管输出光耦产品概述

一、产品简介

TLP185 是东芝(TOSHIBA)推出的一款晶体管输出型光电耦合器,采用光电三极管输出结构,单通道封装(SOP-4, 2.54 mm 引距),面向工业控制、微控制器接口和电气隔离场合。该器件输入为直流驱动,具有高隔离电压和较低的集电极饱和电压,能在较宽的温度范围内稳定工作,适合需要信号隔离与电平移位的应用。

二、主要特点

  • 单通道光电三极管输出,便于点对点隔离设计。
  • 隔离电压(RMS):3.75 kV,满足高电位差隔离要求。
  • 输出耐压(负载电压)可达 80 V,适用于较高侧电路。
  • 最大输出电流(集电极电流)50 mA,可直接驱动小功率负载或后级电路。
  • 集射极饱和电压 Vce(sat):典型 0.3 V(条件:Ic = 2.4 mA,IF = 8 mA),导通损耗低。
  • 输入正向电压 Vf≈1.25 V,输入反向耐压约 5 V。
  • 上升/下降时间:上升 5 μs、下降 9 μs(测试条件:IF=2 mA,负载 100 Ω),响应速度适中,适合中低速数字信号隔离。
  • 工作温度范围宽:-55 ℃ 到 +110 ℃,适应工业环境。

三、关键电气参数(概要)

  • 输入:DC 驱动,正向电压约 1.25 V,反向电压 5 V。
  • 输出:光电三极管,最大集电极电流 50 mA,负载电压 80 V。
  • 隔离:3.75 kV(rms)。
  • 开关性能:tr ≈ 5 μs,tf ≈ 9 μs(在 IF=2 mA,RL=100 Ω 条件下)。
  • 饱和特性:Vce(sat) ≈ 300 mV(Ic=2.4 mA,IF=8 mA)。

四、封装与可靠性

器件采用 SOP-4(2.54 mm 引距)封装,体积小、易于贴装与线间距布局。凭借东芝的制造与测试流程,器件在高隔离电压和宽温度区间内具有良好的可靠性,适合长期工业使用。

五、典型应用场景

  • MCU 与高压电路间的信号隔离(开关量输入/输出隔离)。
  • 电源开关、继电器驱动和状态监测隔离。
  • 工业控制系统中的安全隔离与干扰抑制。
  • 电机驱动、逆变器控制回路的低速反馈与检测接口。

六、设计与使用建议

  • 输入侧请根据所需的 LED 电流选择限流电阻,注意 Vf≈1.25 V 与最大驱动电流限制。
  • 输出侧若需在高电压或大电流条件下工作,应留有足够散热和保护电路(限流、钳位器件)。
  • 在高噪声环境下,可在输出端增加上拉电阻与滤波网络以提高抗干扰性并控制上升/下降时间。
  • 样品验证时,应按实际工况验证隔离要求与热耗散,确保满足系统可靠性需求。

综上,TLP185 以其高隔离、适中的开关速度和低饱和电压,适用于需要可靠电气隔离且驱动能力中等的工业与消费电子场景。

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