WMSIC Electronic Components

TB5128FTG(CP,EL TB5128FTG

ModelTB5128FTG(CP,EL
PackageQFN-48
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TB5128FTG(CP, EL
Type
TOSHIBA
Minimum package
4000

Technical parameters

Electronic Component
TOSHIBA
Electronic Component
TB5128FTG(CP,EL
Electronic Component
1
Package
QFN-48
Electronic Component
Stepper Motor Driver IC
Electronic Component
0.185g
Electronic Component
1
Features
Built-in Charge Pump;; positions
Electronic Component
BM0211333709
Resistor
250mΩ
Interface Type
STEP / DIR
Voltage
4.75V~5.25V
Electronic Component
8;64;2;128;32;1;16;4
Output Current
5A
Integrated Switch
Electronic Component
Driver Type
Driver

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TB5128FTG(CP,EL) 产品概述

一、产品简介

TB5128FTG 是东芝(TOSHIBA)推出的一款高性能双极步进电机驱动芯片,封装为 QFN-48,面向需要高电流密度和精细微步控制的工业与消费类步进驱动应用。芯片集成开关元件,内阻低(导通电阻约 250 mΩ),可直接驱动中小功率双极步进电机,简化驱动电路设计并提高系统可靠性。

二、主要性能参数

  • 控制电源(Vcc):4.75 V ~ 5.25 V,适配常见微控制器逻辑电平。
  • 电机驱动电压(Vm):6.5 V ~ 44 V,覆盖从低压到中高压电机供电需求,适合多种电机规格。
  • 输出电流:最大 5 A(单相峰值或稳态请依据 Datasheet 与散热条件确认)。
  • 驱动类型:双极驱动(Bipolar H-Bridge)。
  • 步进细分(微步):支持 1、2、4、8、16、32、64、128 等分辨率,可通过外部模式引脚配置,实现较高定位精度与更平滑的运行。
  • 集成开关:芯片内部集成功率开关(MOSFET),降低外部元器件数量。
  • 导通电阻:约 250 mΩ(顺序参考,影响功耗与发热)。

三、设计要点与应用建议

  • 散热与布局:芯片在高电流工作时发热明显,建议在 PCB 上设计大面积散热铜箔并使用热沉或底板导热。QFN-48 引脚底部应焊接良好散热垫,保证热阻最低。
  • 电源与谐波管理:电机供电侧建议配置低 ESR 电解电容(如 100 µF 以上)并并联高频陶瓷去耦(0.1 µF~1 µF),同时在 Vm 上视需要添加 TVS 或吸收网络以抑制反向尖峰。
  • 控制接口与滤波:控制电压为 5 V 级,配合 MCU 时注意抖动与上升沿抑制,可在逻辑引脚适当加去耦或小电阻以改善抗干扰能力。微步选择通过 MODE 引脚设置,布线尽量短且避免噪声耦合。
  • 电流限制与保护:尽管芯片集成功率开关,仍需参考官方 Datasheet 设置电流限制与保护参数,必要时在系统层面加入过流/过热检测与软启动策略,防止长期过载。
  • EMC 与接地:电机驱动为高能量开关电路,良好接地和分区布线可减少辐射干扰,控制端与功率端应采用星形接地或分区接地策略。

四、典型应用场景

适用于 3D 打印机、桌面 CNC、机器人关节、摄像云台、办公自动化设备(如打印机、扫描仪)以及工业定位与装配设备等,尤其在需要较高微步分辨率与稳定运行的精密定位场景表现优良。

五、选型与注意事项

在选型和集成时,请务必参照东芝官方 Datasheet 获取完整的电气特性、引脚定义、典型应用电路与热设计指南。确认实际应用的电流波形、峰值需求与散热能力是否匹配芯片最大额定值,必要时预留余量以保证长期可靠性。

结语:TB5128FTG 以其宽工作电压、高输出电流与丰富的微步选项,适合对运动控制精度与功率密度有较高要求的步进电机驱动系统。在实现时注重电源滤波、散热与 PCB 布局,可发挥其良好的驱动性能并提升系统稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.