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TLP2368(TPL,E(T TLP2368
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP2368(TPL, E(T
- Type
- TOSHIBA
- Minimum package
- 3000
Technical parameters
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP2368(TPL,E(T
- Electronic Component
- 1
- Package
- SO6
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Electronic Component
- 30ns
- Electronic Component
- BM0000002927
- Operating Temperature
- 40℃~+125℃
- Load Voltage
- 6V
- Type
- DC
- Output Current
- 25mA
- Output Channel Count
- 1
- (tr)
- 30ns
- (Vf)
- 1.55V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP2368(TPL,E(T 产品概述
一、产品简介
TLP2368(TPL,E(T 是由东芝（Toshiba）公司推出的一款高性能光耦合器，是一种集成的光电隔离元件，专为高速数据传输设计。这款光耦广泛应用于各种电子设备，包括工业自动化、家用电器、通信设备及数据处理系统等。凭借其优越的性能和可靠性，TLP2368已成为市场上优秀的光耦选择之一。
二、产品特点
高性能隔离性：TLP2368提供高达5000V的电气隔离，确保在高压应用环境中也能安全工作。其优越的绝缘特性保护了后端电路不受高电压干扰，显著提高了设备的安全性和稳定性。
高速数据传输：该光耦支持高达1Mbps的数据传输速率，适合需要高速通讯的应用场景。此外，其低延迟特性确保在数字信号转换过程中信息传递的及时性。
低功耗设计：TLP2368在工作状态下的功耗较低，非常适合移动设备和低功耗应用。这使得它能够应用于各种节能型设备中，在保证性能的同时降低能耗。
宽工作温度范围：该光耦具有-40°C至+100°C的宽工作温度范围，适应极端环境下的工作需求，确保其在不同温度条件下依然保持良好性能。
小型封装设计：采用SOP封装，TLP2368具有较小的体积，适合空间受限的应用场合。这种紧凑的设计使得在PCB布局中更为灵活，有助于优化整体系统的空间利用率。
三、应用场景
工业自动化：TLP2368可用于伺服驱动器、PLC（可编程逻辑控制器）和各种工业设备中，实现控制和信号的光电隔离，保障整个系统的安全及稳定运行。
通信设备：在数据通讯系统中，TLP2368可用于ADSL调制解调器、交换机和路由器等设备，提供高速信号隔离和传输，确保数据的可靠性和有效性。
电源管理：该光耦可广泛用于开关电源、逆变器及各种电源方案中，帮助在高电压和低电压之间实现有效的信号隔离，从而提高系统的稳定性和安全性。
消费电子：在家电、音响及其他电子产品中，TLP2368能够提供有效的信号隔离与传递，保障设备性能及用户安全。
四、技术参数概述
- 封装类型：SOP-5
- 工作温度范围：-40°C ~ +100°C
- 插入损耗（IL）：典型值为-30dB（频率：1MHz）
- 隔离电压：5000Vrms
- 数据传输速率：高达1Mbps
五、总结
TLP2368(TPL,E(T 作为一款高性能的贴片光耦，其优秀的电气特性和多样的应用领域，使其成为当今电子设计中不可或缺的重要元件。无论是在工业控制、数据通信还是消费电子产品中，TLP2368都能提供卓越的性能和安全保障。凭借其小型封装和低功耗特性，这款光耦为设计工程师在开发现代高效率、低功耗产品时提供了更多选择。通过选择TLP2368，用户将能够实现更高水平的系统集成与优化，满足市场对安全性和性能日益增长的需求。
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