WMSIC Electronic Components

1SS302(TE85L,F) 1SS302

Model1SS302(TE85L,F)
PackageSC-70
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

14 specifications

Core information

Product name
TOSHIBA 1SS302(TE85L, F)
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
1SS302(TE85L,F)
Electronic Component
1
Package
SC-70
Electronic Component
Switch Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM69418485
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS302(TE85L,F) 产品概述

一、产品简介

1SS302是日本东芝公司(TOSHIBA)推出的一款开关二极管,通常用于高频信号的切换与整流等应用。其封装形式为SC-70(SOT-323),是一种小型的表面贴装(SMD)封装,这使得其在低功耗和小尺寸的电子设备中得到广泛应用。

二、基本特性

  1. 封装形式:1SS302采用SC-70-6封装,具有小巧、轻便的特点,适合高密度的电路布局。这种封装还可以降低电路的总占用空间,非常适合于现代电子产品的小型化设计需求。

  2. 反向电压:该二极管具有较高的反向电压等级,通常在50V左右,能够适应多种电压环境下的应用,增强了其在不同电源系统中的通用性。

  3. 正向电流:1SS302在一定条件下可承受最大正向电流,通常为200mA。这一特性使其能够用于一些中等电流的应用场合,同时也保证了良好的工作稳定性。

  4. 开关特性:该二极管的开关速度非常快,具有低的恢复时间和短脉冲响应,适合用于高频应用,比如开关电源、射频(RF)通信等。

  5. 工作温度范围:1SS302支持较宽的工作温度范围,通常从-55°C到+125°C,这允许其在极端环境下仍然保持良好的工作性能,适合各种工业和消费电子产品。

三、应用领域

1SS302开关二极管可广泛应用于以下几个领域:

  1. 消费电子:由于其小型封装,1SS302特别适合用于手机、平板电脑、智能穿戴设备等消费电子产品中,作为信号切换和整流组件。

  2. 通信设备:在射频信号的处理、发射与接收中,1SS302能够有效地快速开关信号,确保信号的完整性和稳定性,广泛应用于无线基站、路由器、及其他通信模块。

  3. 工业控制:在工业自动化和控制系统中,1SS302可用于无源元件的开关,无论是在传感器信号处理还是在电机驱动模块方面,都发挥着重要作用。

  4. 汽车电子:随着汽车电子设备的不断升级,1SS302可用于各种车载系统,如导航、AV系统及电源管理等,提供高效的信号转换和保护。

四、性能参数

在选择使用1SS302时,设计工程师需要关注以下参数:

  • 正向电压降:VF(通常小于1V),保证了低功耗的特性。
  • 反向恢复时间:trr(极短的恢复时间,可以达到几纳秒级别)适合高频应用。
  • 散热性能:小型封装在高频、高电流条件下会产生一定的热量,选择合适的散热方案以确保二极管的稳定运行。

五、结论

综上所述,1SS302(TE85L,F)开关二极管凭借其小型封装、高性能特性以及广泛适应的应用领域,为现代电子设备提供了可靠的信号处理解决方案。东芝在制造这款元件时,结合了先进的材料和工艺技术,使其在竞争激烈的市场中依然保持优秀的表现。对于专注于高频、高速和低功耗设计的工程师来说,1SS302也是值得考虑的优质选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.