Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TLP2345(V4-TPL,E(T TLP2345
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TOSHIBA TLP2345(V4-TPL, E(T
- Type
- TOSHIBA
- Minimum package
- 3000 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TOSHIBA
- Electronic Component
- TLP2345(V4-TPL,E(T
- Electronic Component
- 1
- Package
- SO-6
- Electronic Component
- Logic Output Optocoupler
- Electronic Component
- 0g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM69418864
- Operating Temperature
- 40℃~+110℃
- Operating Voltage
- 4.5V~30V
- Type
- DC
- Power Dissipation(Pd)
- 100mW
- tp HL
- 120ns
- tp LH
- 120ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TLP2345 光耦合器件产品概述
一、产品简介
TLP2345是东芝（TOSHIBA）公司推出的一款高性能光耦合器件，分为SO-5封装形式，广泛应用于工业控制、通信设备及家用电器等领域。作为一款双向光隔离器，TLP2345能够高效地传输数据信号，同时有效地隔离输入与输出之间的电气联系，从而提升系统的安全性和稳定性。
二、基本特性
光耦合功能: TLP2345采用了LED作为发光元件和高灵敏度的光电接收器，实现了高效的光电转换。其主要功能是将输入信号通过光信号传输至输出端，实现隔离与信号传递。
高耐压性能: TLP2345具备优越的耐电压特性，最高工作电压可达5000V。这使得它在高压环境下工作时，依然能保持优良的隔离性能，大大增加了系统的可靠性。
快速响应时间: 该光耦合器的响应时间非常短，能够满足高速信号的传输需求，通常适用于对响应速度要求较高的应用场景。
优秀的温度特性: TLP2345在宽温环境下运行良好，适应性强，适合在多种温度条件下使用，通常工作温度范围为-40°C至100°C。
宽泛应用: 由于其优异的性能和特性，TLP2345常被应用于工业设备的信号隔离、数据转换、开关电源、智能家居、可编程逻辑控制等各个领域中。
三、关键参数
输入涨落电压(VF): 设定范围内的工作电压，对于大多数应用场景支持较为可靠的输入信号。
光电流传输比(CTR): TLP2345具备极好的光电流传输比，能够确保即便在低输入电流情况下也能实现理想的输出。
封装特性: SO-5封装使得TLP2345具备较小的体积，并且直插式设计方便与其他电路组件配合使用，便于实现紧凑的电路板设计。
四、应用场景
工业控制系统: TLP2345的高耐压特性及良好的响应时间使其非常适合用于工业控制系统中的信号隔离，能够有效避免由于系统或信号故障导致的设备损坏。
通信设备: 在通信设备中，TLP2345被广泛使用于数据链路中的信号隔离，保证信号的完整性以及设备之间的安全隔离。
电源管理: 在开关电源和电池充电器等电源管理设备中，TLP2345可以提供必要的隔离保护，同时保证高效的信号传递。
智能家居: 随着智能家居设备的普及，TLP2345的高可靠性与低功耗特性，为家庭自动化设备提供了理想的解决方案。
五、总结
TLP2345光耦合器件凭借其优异的电气性能和综合特性，成为一款广泛应用于多个行业的重要产品。无论是在工业控制、通信设备还是智能家居产品中，它都能提供出色的隔离效果和信号传输能力，确保系统的安全性与稳定性。随着科技的发展，TLP2345将继续作为高效、可靠的光耦解决方案，满足日益增长的市场需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
