WMSIC Electronic Components

TOGIALED TJ-S1005CL4T5ALC3DW-A5

ModelTJ-S1005CL4T5ALC3DW-A5
Package0402
BrandTOGIALED
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOGIALED TJ-S1005CL4T5ALC3DW-A5
Type
TOGIALED
Minimum package
5000 编带

Technical parameters

Power
108mW
Electronic Component
Electronic Component
Electronic Component
TOGIALED
Electronic Component
TJ-S1005CL4T5ALC3DW-A5
Electronic Component
1
Package
0402
Electronic Component
LEDDiode / LED
Electronic Component
2800K~3500K
Electronic Component
0.024g
Electronic Component
1
LED
800mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0229921594
Operating Temperature
20℃~+80℃
Current
20mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJ-S1005CL4T5ALC3DW-A5 产品概述

一、产品简介

TJ-S1005CL4T5ALC3DW-A5 为 TOGIALED(统佳)推出的 0402 小封装暖白贴片 LED。器件发光颜色为白色,色温 2800K~3500K,配黄色透镜以增强暖色调视觉效果;典型发光强度 800 mcd,视角宽达 120°,适合需要宽视角且色温偏暖的微型照明与指示场合。

二、电气与光学参数

  • 正向电压(Vf):3.4 V(典型值,If=20 mA)
  • 正向电流(If):20 mA(额定)
  • 功率:108 mW(产品标称功率);在 Vf=3.4 V、If=20 mA 条件下器件耗散功率约为 68 mW(3.4V×0.02A),建议按厂家最大功耗规范使用并留有余量。
  • 发光强度:800 mcd(典型)
  • 发光角度:120°
  • 色温:2800K~3500K(暖白)

三、封装与环境特性

  • 封装:0402(典型尺寸 1.0 × 0.5 mm),适用于高密度贴片装配
  • 透镜颜色:黄色透镜(有利于暖白光的色彩表现与漫射)
  • 工作温度:-20°C ~ +80°C,适配一般消费电子、家电和背光领域的环境温度范围

四、应用场景

适用于:键盘/按键背光、小型指示灯、移动设备状态指示、穿戴设备、微型装饰照明、仪表盘与面板背光(室内/舱内场景)、物联网终端等对体积、视角与暖白色彩有要求的场合。

五、使用与推荐驱动

  • 建议恒定电流驱动以保证光输出与寿命稳定;若采用限流电阻,按 R = (Vs − Vf)/If 计算(例如 5V 电源:R ≈ (5−3.4)/0.02 ≈ 80 Ω,常用 82 Ω)。
  • 考虑封装热阻与工作环境,尽量降低结温:在高环境温度下应适当降额(降低 If)以延长寿命与稳定性。
  • 贴装建议采用常规回流焊工艺,遵循统佳的焊接与翻转贴装说明,避免过热与机械应力集中。

六、可靠性与注意事项

  • 0402 体积小,易受机械应力与静电损伤,装配时需防静电保护(ESD)并使用适合的取放与回流参数。
  • 见光通电或高温下应注意长期漂移与光通量衰减,建议做温度与寿命验证以确定使用寿命与维护策略。
  • PCB 走线与焊盘设计请参考厂方推荐封装资料,保证散热与焊接质量。

如需封装图、光学曲线、推荐回流曲线或更多样品与批量采购信息,可提供具体需求以便进一步反馈。

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