WMSIC Electronic Components

TOGIALED TJ-S3806SW1TGLC6FRGB-A5

ModelTJ-S3806SW1TGLC6FRGB-A5
PackageSMD-6P,4.5x1mm
BrandTOGIALED
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOGIALED TJ-S3806SW1TGLC6FRGB-A5
Type
TOGIALED
Minimum package
4000 圆盘

Technical parameters

Power
R:72mW;G:108mW;B:108mW
Electronic Component
Electronic Component
Electronic Component
TOGIALED
Electronic Component
TJ-S3806SW1TGLC6FRGB-A5
Electronic Component
1
Electronic Component
1mm
Package
SMD-6P,4.5x1mm
Electronic Component
G:520nm~530nm;R:620nm~630nm;B:465nm~470nm
Electronic Component
RGB LED
Electronic Component
0.033g
Electronic Component
4.5mm
Electronic Component
0.9mm
Electronic Component
1
LED
G:800mcd~1500mcd;B:300mcd~800mcd;R:300mcd~800mcd
LED
120°
Electronic Component
BM0264488319

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJ-S3806SW1TGLC6FRGB-A5 产品概述

一、产品简介

TJ-S3806SW1TGLC6FRGB-A5 是 TOGIALED(统佳)推出的一款高密度侧发三色 RGB LED,采用 SMD-6P 封装,外形尺寸 4.5 × 1.0 × 0.9 mm。器件内含三颗独立二极管(R/G/B),以侧向发光(侧贴)方式出光,适合边缘照明、字符背光、指示与装饰照明等对窄型、侧发光要求高的应用场景。独立二极管的设计提供了色彩灵活性和高精度的颜色混合控制。

二、主要电光参数

  • 发光颜色及典型峰值波长:
    • R(红):典型峰值 635 nm(规格标称范围 620–630 nm)
    • G(绿):典型峰值 520 nm(规格标称范围 520–530 nm)
    • B(蓝):典型峰值 464 nm(规格标称范围 465–470 nm)
  • 发光强度(典型 / 范围,单位 mcd):
    • G:800 ~ 1500 mcd
    • B:300 ~ 800 mcd
    • R:300 ~ 800 mcd
  • 发光角度:120°
  • 正向压降 Vf(典型范围):
    • R:1.8 V ~ 2.4 V
    • G:2.8 V ~ 3.6 V
    • B:2.8 V ~ 3.6 V
  • 功率(额定):R 72 mW;G 108 mW;B 108 mW

注:上述光电参数为规格范围或典型值,实际值受驱动电流、PCB热散、工作温度等因素影响。出厂或数据手册通常基于特定测试电流(参考样片测试条件)得出,使用时请结合系统驱动条件确认。

三、结构与封装

  • 封装形式:SMD-6P,侧发(侧贴)
  • 外形尺寸:长度 4.5 mm,宽度 1.0 mm,高度 0.9 mm
  • 二极管配置:三色独立二极管,支持分别驱动
  • 载带方式:侧贴(侧向进带),便于高速贴装与自动化生产 该封装在狭长空间能提供均匀侧向出光,同时保持较小占板面积,适合空间受限的边缘光源设计。

四、热与环境特性

  • 工作温度范围:-40 ℃ ~ +80 ℃
  • 三色独立芯片的热管理需在 PCB 设计阶段予以考虑:尽量采用良好铜箔散热、合理的焊盘尺寸与散热通道,以维持输出稳定性与寿命。
  • 在高环境温或高驱动下,发光强度和波长会随温度漂移,需在系统级验证颜色一致性与热鲁棒性。

五、典型应用

  • 仪表盘、按键背光与状态指示
  • 商业显示条/导光条的边缘均匀侧向照明
  • 消费电子产品(机箱指示、键盘、手持设备)的小型 RGB 点光源
  • 装饰照明与标识牌、微型矩阵灯条等需要狭长侧发光解决方案的场景

六、使用建议与注意事项

  • 驱动方式:建议恒流驱动,采用独立通道驱动器或 PWM 恒流源进行亮度与色彩控制;为保证一致性,使用合适的限流元件并在 PCB 上为每色留足焊盘。
  • 调光与颜色校准:PWM 调光常用于色域控制,频率建议高于可见闪烁阈值(通常 >1 kHz)以避免肉眼可见闪烁。对色彩精度有较高要求的应用,需进行软件或硬件上的颜色校准。
  • 焊接工艺:作为 SMD 组件应适配常规回流焊流程。建议在工程验证阶段确认回流峰值温度与实际焊接可靠性(数据手册中若有回流曲线说明,以数据手册为准)。
  • 环境可靠性:长期在高温或高湿环境下工作,会影响光输出与寿命,建议在系统设计中考虑密封与散热方案。
  • 底层 PCB 与遮光:为实现侧发光的均匀性,板面设计可配合反射结构或光学扩散元件,避免直视观察时的光斑不均。

七、封装与订购信息

  • 品牌:TOGIALED(统佳)
  • 型号:TJ-S3806SW1TGLC6FRGB-A5
  • 封装:SMD-6P,4.5 × 1.0 × 0.9 mm,侧发 RGB,独立三二极管
  • 载带方式:侧贴(适配自动贴片机) 如需样品、批量报价或详细数据手册(含典型光电曲线、回流焊规范、推荐 PCB 封装),建议联系厂商或经销商索取最新技术资料与元件一致性报告,以便在产品开发阶段完成可靠性与光色一致性验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.