WMSIC Electronic Components

TOGIALED TJ-S2012CY8T5ALC6B-A5

ModelTJ-S2012CY8T5ALC6B-A5
Package0805
BrandTOGIALED
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOGIALED TJ-S2012CY8T5ALC6B-A5
Type
TOGIALED
Minimum package
3000 圆盘

Technical parameters

Power
108mW
Electronic Component
Electronic Component
Electronic Component
TOGIALED
Electronic Component
TJ-S2012CY8T5ALC6B-A5
Electronic Component
1
Package
0805
Electronic Component
460nm~470nm
Electronic Component
LEDDiode / LED
Electronic Component
0.027g
Electronic Component
1
LED
200mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0264488328
Electronic Component
465nm
Operating Temperature
40℃~+80℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJ-S2012CY8T5ALC6B-A5 产品概述

TJ-S2012CY8T5ALC6B-A5 是 TOGIALED(统佳)推出的一款高亮 0805(2012 公制)蓝光贴片 LED,适用于空间受限且需要较宽发散角度的指示与背光场合。该器件以 460–470 nm 的短波蓝光为主,峰值波长 465 nm,配合透明透镜与独立二极管结构,提供稳定可视的指示效果与良好的装配兼容性。

一、主要技术参数

  • 发光颜色:蓝色
  • 峰值波长:465 nm(波长范围 460–470 nm)
  • 正向电流(If):20 mA(典型驱动电流)
  • 正向压降(Vf):2.8 V ~ 3.4 V
  • 功率:108 mW(器件最大功率额定)
  • 发光强度:200 mcd(在标称测试条件下)
  • 发光角度:120°(宽视角设计)
  • 二极管配置:独立二极管
  • 透镜颜色:无色透明透镜
  • 工作温度范围:-40 ℃ ~ +80 ℃
  • 封装:0805(等同 2012 公制)

二、产品亮点

  • 宽视角(120°):适合需要大视角均匀指示的面板或状态显示。
  • 透明透镜与独立二极管:光学输出清晰、便于单独驱动和维修替换。
  • 小型 0805 封装:兼容常见贴片工艺,适合高密度 PCB 布局。
  • 宽工作温度:-40℃ 至 +80℃,可适应大多数工业及消费类使用环境。

三、外观与封装说明

该器件采用行业常见 0805(2012)贴片封装,透明透镜无色,便于获得纯净蓝光输出。尺寸小、厚度低,适配自动贴装与标准回流焊工艺。具体尺寸请参考 TOGIALED 官方封装图纸以便进行 PCB 封装和光学设计。

四、驱动与电路设计建议

  • 驱动电流:器件额定 If 为 20 mA,为保证长期可靠性与热管理,建议在常规应用中采用 10–15 mA 的驱动电流,必要时可短时使用 20 mA,但应考虑温升与寿命折算。
  • 限流电阻计算:采用线性限流时,可用公式 R = (Vsup - Vf) / If。
    • 例如 Vsup = 5 V,取 Vf 最大值 3.4 V、If = 20 mA,则 R = (5 - 3.4) / 0.02 = 80 Ω → 取标准值 82 Ω;限流电阻功耗 P = (5 - 3.4) × 0.02 = 0.032 W,1/4 W 电阻足够。
    • 如果电源为 3.3 V,因 Vf 可能高于或接近电源电压,建议改用恒流源或使用多个串联 LED。
  • PWM 调光:支持 PWM 调光以实现亮度控制,建议 PWM 频率 >200 Hz 以避免闪烁肉眼可见。
  • 热管理:尽管单颗功率不高,长期 20 mA 驱动会产生典型功耗(Vf×If),须在 PCB 设计时保证散热路径,避免封装过热导致光衰或寿命降低。

五、可靠性与工作环境

  • 工作温度:-40 ℃ 至 +80 ℃,在此范围内具有稳定光输出与电气特性。
  • 存储与运输:建议避免潮湿与高温环境,包装完好保存,开卷后按标准回流焊干燥存放或回流前进行必要的干燥烘焙。
  • ESD 防护:为半导体器件,需在装配与测试过程中采取静电防护措施(如佩戴防静电手环、使用防静电工作台等)。

六、典型应用场景

  • 消费电子指示灯(如家电、遥控终端)
  • 仪器仪表面板指示
  • 工业控制与状态显示
  • 小型背光、指示条、信号灯及 PCB 状态指示

七、装配与注意事项

  • 推荐使用标准 SMD 回流焊工艺,回流峰值温度请参照 TOGIALED 的回流曲线(通常峰值不超过 260 ℃ 并遵循 IPC 焊接规范)。
  • 机器贴装建议配合 0805 芯片的拾取与放置参数,避免透镜表面刮擦。
  • 在焊接与测试过程中避免反复长时间高温暴露,以免引起光衰或封装变色。
  • 开卷后若封装袋内含有吸湿剂,根据湿敏等级(MSL)建议在规定时间内回流,必要时进行烘烤处理。

八、型号与采购说明

型号:TJ-S2012CY8T5ALC6B-A5,品牌:TOGIALED(统佳),封装:0805。采购与更详细的技术文档(如光学曲线、机械尺寸图、回流焊曲线、可靠性测试报告)请联系 TOGIALED 官方渠道或授权代理商以获取最新资料与批量供货信息。

如需我为您提供基于特定电源电压或 PCB 布局的驱动电路示意、亮度估算或热仿真建议,可提供电源与使用场景,我将基于这些条件给出更具体的设计参考。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.