WMSIC Electronic Components

TAI-TECH HCB2012KF-101T30 HCB2012KF

ModelHCB2012KF-101T30
Package0805
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TAI-TECH HCB2012KF-101T30
Type
TAI-TECH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
HCB2012KF-101T30
Electronic Component
1
Package
0805
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.038g
Electronic Component
1
Channel Count
1
Electronic Component
BM0265420036
Current
3A
@Frequency
100Ω@100MHz
Resistor(DCR)
40mΩ
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCB2012KF-101T30 产品概述

1. 产品简介

HCB2012KF-101T30 是一款由 TAI-TECH(台庆)公司生产的高性能磁珠,属于电子元器件中的被动元件类别。该磁珠主要用于抑制电路中的高频噪声,广泛应用于通信设备、计算机、消费电子、工业控制等领域。其紧凑的0805封装尺寸使其适用于高密度PCB布局,同时提供优异的噪声抑制性能。

2. 关键参数

  • 商品分类: 磁珠
  • 标称阻抗@测试频率: 100Ω @ 100MHz
  • 电路数: 1
  • 直流电阻 (RDC): 40mΩ
  • 误差: ±25%
  • 额定电流: 3A
  • 封装尺寸: 0805 (2.0mm x 1.2mm)

3. 技术特点

  • 高频噪声抑制: HCB2012KF-101T30 在100MHz频率下提供100Ω的阻抗,有效抑制高频噪声,提升电路的信噪比。
  • 低直流电阻: 40mΩ的直流电阻确保在通过大电流时,磁珠本身的功耗极低,减少能量损失。
  • 高额定电流: 3A的额定电流使其能够承受较大的电流负载,适用于多种高功率应用场景。
  • 紧凑封装: 0805封装尺寸使其适用于高密度PCB设计,节省空间,提高设计灵活性。
  • 宽误差范围: ±25%的误差范围提供了较大的设计余量,适应不同应用需求。

4. 应用领域

HCB2012KF-101T30 广泛应用于以下领域:

  • 通信设备: 用于抑制通信设备中的高频噪声,提高信号质量。
  • 计算机: 在计算机主板、显卡等设备中,用于减少电磁干扰,提升系统稳定性。
  • 消费电子: 在智能手机、平板电脑等消费电子产品中,用于抑制电源噪声,延长电池寿命。
  • 工业控制: 在工业控制系统中,用于减少电磁干扰,提高控制精度和可靠性。

5. 设计考虑

在设计使用HCB2012KF-101T30时,需考虑以下因素:

  • 频率特性: 磁珠的阻抗随频率变化,需根据实际应用频率选择合适的磁珠。
  • 电流负载: 确保磁珠的额定电流大于电路中的最大电流,避免磁珠过热或损坏。
  • PCB布局: 0805封装尺寸较小,需合理安排PCB布局,确保磁珠与其他元件的间距足够,避免相互干扰。

6. 品牌介绍

TAI-TECH(台庆)是一家知名的电子元器件制造商,专注于被动元件的研发和生产。公司以其高质量的产品和卓越的技术支持在行业内享有盛誉。TAI-TECH的产品广泛应用于全球各地的电子设备中,为客户提供可靠的解决方案。

7. 总结

HCB2012KF-101T30 是一款高性能的磁珠,具有优异的噪声抑制能力和高额定电流,适用于多种电子设备。其紧凑的0805封装尺寸和高可靠性使其成为高密度PCB设计的理想选择。TAI-TECH(台庆)作为该产品的制造商,以其卓越的技术和高质量的产品赢得了市场的广泛认可。无论是在通信设备、计算机、消费电子还是工业控制领域,HCB2012KF-101T30 都能提供卓越的性能和可靠性,满足各种应用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.