WMSIC Electronic Components

TAI-TECH FCI2012TF-100K FCI2012TF

ModelFCI2012TF-100K
Package0805
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
TAI-TECH FCI2012TF-100K
Type
TAI-TECH
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TAI-TECH
Electronic Component
FCI2012TF-100K
Electronic Component
1
Package
0805
Electronic Component
SMD Inductor
Electronic Component
±10%
Electronic Component
0.038g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0257222551
Current
15mA
Resistor(DCR)
1.15Ω
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FCI2012TF-100K 产品概述

一、产品简介

FCI2012TF-100K 是台庆(TAI-TECH)系列贴片电感,适配 0805(2012 公制)封装,设计用于低电流、阻尼型滤波与信号线抗干扰场合。器件电感值为 10 µH,标称精度 ±10%,直流电阻(DCR)较高为 1.15 Ω,额定通过电流 15 mA,定位为小电流、阻性较明显的滤波元件。

二、主要电气参数

  • 电感值:10 µH ±10%
  • 额定电流:15 mA(建议在额定电流以下工作以避免磁饱和与温升)
  • 直流电阻(DCR):1.15 Ω(高 DCR 特性,影响直流压降与 Q 值)
  • 封装:0805(俗称 2012 公制)
  • 品牌:TAI-TECH(台庆)

三、特性与典型应用

  • 特性:高 DCR 配合较大电感值,适合用于构成 RC/LC 阻尼滤波器、工艺中用于抑制中低频干扰与振铃;体积小、焊接可靠,适合自动贴装。
  • 典型应用:时钟/低频信号线滤波、模拟前端抑噪、低功耗设备的 EMI 抑制、传感器接口及电池供电模块的噪声滤波等。不适合用作大电流能量传输或高 Q 高频谐振元件。

四、封装与机械特性

  • 0805 封装,典型尺寸约 2.0 mm × 1.25 mm,厚度随厂商工艺略有差异。
  • 表面贴装设计,适用于回流焊工艺,便于 SMT 自动化装配。型号命名中的 “2012” 与 0805 尺寸对应,便于与 PCB 尺寸规范匹配。

五、使用建议与注意事项

  • PCB 布局:应将该电感放置于需滤波信号路径上,远离高电流导线与敏感磁性元件,若并联大地平面请注意走线间距以避免不必要的耦合。
  • 温升与额定电流:鉴于额定电流仅 15 mA,建议留有裕度以减少温升与磁饱和风险。
  • 与电容搭配:与合适容量和额定电压的旁路/耦合电容配合可以形成有效的 LC 滤波网络,设计时计算谐振频率并考虑阻尼。
  • 焊接工艺:遵循厂商推荐回流曲线与 IPC J-STD-020 标准,避免长时间高温暴露以保护内部磁芯与粘结材料。

六、存储与质量保障

  • 存储:避免潮湿、高温与强磁场环境,密封包装并在保质期内使用以保证焊接性与电性能。
  • 质量与可靠性:建议在设计验证阶段进行温度循环、热冲击与焊接可靠性测试,确认在目标应用条件下的稳定性与寿命。

总结:FCI2012TF-100K(10 µH,±10%,DCR 1.15 Ω,15 mA,0805)为一款面向低电流、需要阻尼或抑制中低频干扰的贴片电感器,适用于空间受限且对电流要求不高的滤波与抗干扰场合。设计时应重点关注其高 DCR 与低额定电流特性,合理布线与热管理可确保长期可靠运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.