WMSIC Electronic Components

TAI-TECH HCB1608KF-221T25 HCB1608KF

ModelHCB1608KF-221T25
Package1608
BrandTAI-TECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 171055

Availability on request

Technical data

Product details

17 specifications

Core information

Product name
TAI-TECH HCB1608KF-221T25
Type
TAI-TECH
Minimum package
4000

Technical parameters

Electronic Component
TAI-TECH
Electronic Component
HCB1608KF-221T25
Electronic Component
1
Package
1608
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.036g
Electronic Component
1
Electronic Component
BM0264896655
Operating Temperature
55℃~+125℃
Current
2.5A
@Frequency
220Ω@100MHz
Resistor(DCR)
50mΩ
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HCB1608KF-221T25 产品概述

一、产品简介

HCB1608KF-221T25 为 TAI-TECH(台庆)出品的商规级贴片抗干扰元件,常用于电源线和信号线的射频干扰抑制。该器件采用 1608 封装(公制尺寸 1.6 mm × 0.8 mm,等同于英制 0603),体积小、适配高密度贴片工艺,适合移动设备、通信模块、消费电子与工业控制等场景的 EMI/ESD 抑制设计。

二、主要参数

  • 阻抗:220 Ω @ 100 MHz(标称值)
  • 误差:±25%
  • 直流电阻(DCR):约 50 mΩ
  • 额定电流:2.5 A(连续额定)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 品牌:TAI-TECH(台庆)
  • 封装:1608(贴片)

三、性能特点

  • 高频抑制能力强:在 100 MHz 处阻抗达 220 Ω,可有效衰减高频噪声和射频干扰,改善系统的电磁兼容性。
  • 低直流电阻:约 50 mΩ 的 DCR 有利于在大电流传输中保持较低的功率损耗和发热,适合电源线滤波应用。
  • 宽温度范围:-55 ℃ 至 +125 ℃,满足大多数工业与民用环境的温度要求。
  • 商规等级:适配常规商业电子产品的可靠性与成本要求。

四、典型应用场景

  • 手机、平板等便携设备中的电源滤波与 EMI 抑制;
  • 通信终端、Wi‑Fi、蓝牙模块的射频前端噪声治理;
  • 工业控制与电源模块的开关噪声抑制;
  • 汽车低速非关键子系统(须结合车规件要求)与消费电子产品的 PCB 布局滤波。

五、封装与标识

1608 表面贴装封装,便于自动贴装与回流焊工艺;料号中 “221” 对应阻抗等级(220 Ω),后缀 “T25” 指示公差 ±25%。出货及贴片加工时请参考 TAI-TECH 的包装与回流焊工艺说明,遵循推荐的锡膏、回流曲线和湿气敏感度(如有)要求。

六、选型与使用建议

  • 电流裕量:尽管额定电流为 2.5 A,建议在设计时留出裕度,避免长期在额定值附近工作以降低发热与失效风险;若为持续高电流场合,考虑更大封装或并联多颗。
  • 热管理:在高功率或密集布局环境下,注意周围元件散热和 PCB 铜箔面积,以减少温升。
  • 布局:将滤波器件靠近干扰源或器件电源引脚放置,尽量缩短回流路径,配合地平面优化 EMI 效果。
  • 测试验证:在目标系统中进行带载下的阻抗曲线与温升测试,确认 ±25% 公差对滤波效果的影响及是否满足 EMC 规范。

七、可靠性与注意事项

  • 在高湿、高温或强腐蚀环境下使用需评估封装与焊接可靠性;如有苛刻环境要求,建议咨询厂方或选用车规级/军规级产品。
  • 该器件属于被动磁性/铁氧体类滤波元件,对机械冲击与焊接温度敏感,贴装和回流时遵循厂方工艺规范可降低损伤率。

如需完整的阻抗频率曲线、回流焊温度曲线或更详细的可靠性数据(如湿热、循环寿命等),建议联系 TAI-TECH(台庆)获取产品数据手册与测试报告,以便在具体项目中做更精确的工程评估。

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