WMSIC Electronic Components

TMI TMI6240

ModelTMI6240
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI6240
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI6240
Electronic Component
1
Package
SOT-23-5
Type
Load Switch
Electronic Component
Power Electronic Switch
Electronic Component
0.065g
Electronic Component
1
Channel Count
1
Features
Output
Electronic Component
BM0227307355
Resistor
50mΩ
Operating Temperature
40℃~+125℃
Operating Voltage
2.7V~18V
Current
3.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI6240 产品概述

一、产品简介

TMI6240 是拓尔微(TMI)推出的一款单通道负载开关,采用 SOT-23-5 封装,面向便携与车载等需要电源控制与保护的应用场景。器件以高电平有效的输入控制逻辑实现对输出电源的快速管控,兼顾小封装、低导通损耗与多重保护功能,便于系统实现电源管理与故障自保护。

二、主要参数

  • 类型:负载开关(Load Switch)
  • 通道数:1
  • 输入控制逻辑:高电平有效(EN = 高电平,输出导通)
  • 最大连续电流:3.5 A
  • 工作电压:2.7 V ~ 18 V
  • 导通电阻(Rds(on)):50 mΩ(典型)
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装:SOT-23-5
  • 品牌:TMI(拓尔微)

三、保护与功能特性

TMI6240 集成多种硬件保护机制,用以提高系统可靠性:

  • 过热保护(OTP):在器件温度过高时触发保护,防止热损坏。
  • 过压保护(OVP):在输入或输出异常升压时采取保护措施。
  • 短路保护(SCP):在负载短路情况下限制电流或切断输出,降低系统风险。
  • 过流保护(OCP):实现对输出电流的检测与限制,保护器件和负载。

(具体保护触发阈值与动作特性请以官方数据手册为准。)

四、封装与引脚(概述)

SOT-23-5 小封装适合空间受限的应用,典型引脚功能包括:VIN(输入)、VOUT(输出)、EN(使能,高电平有效)、GND(地)及备用/功能引脚。为避免误接与布局问题,建议在设计前查阅器件完整引脚图与封装尺寸表。

五、典型应用与设计注意事项

  • 典型应用:便携设备电源开关、外设电源控制、车载电源管理、电池保护子系统及系统级热/过流保护。
  • PCB 设计建议:VIN/VOUT 及 GND 区域使用较大铜箔以降低热阻并利于散热;在器件附近放置足够的输入与输出旁路电容,靠近引脚焊盘布局以抑制瞬态。
  • 热管理:考虑最大连续电流 3.5 A 与 50 mΩ 导通损耗,在高电流场景需评估封装温升并增加散热面积或铜箔。
  • 控制信号:EN 为高电平有效,驱动电平需与器件工作电压域匹配,避免在非允许电压下切换。

如需引脚定义、时序、典型应用电路与完整电气特性,请参考 TMI6240 的官方数据手册以获得精确参数与典型曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.