WMSIC Electronic Components

TMI TMI3253

ModelTMI3253
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3253
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3253
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.022g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0209680533
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~18V
Switching Frequency
600kHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3253 产品概述

一、概述

TMI3253 是拓尔微(TMI)推出的一款高集成度降压型同步整流开关稳压器,采用 SOT-23-6 小封装,面向要求低静态电流、高效率和中等功率密度的嵌入式应用。器件内置高侧与低侧功率开关,支持外部可调输出电压,输入电压范围宽(4.5V~18V),最大输出电流可达 3A,开关频率为 600kHz,适合汽车电子、工业控制、通信设备和便携式电源管理等应用场景。

二、主要特性

  • 输出类型:可调(外部电阻分压设置输出电压)
  • 拓扑结构:降压(同步整流)
  • 同步整流:内置,降低整流损耗、提升轻载至中载效率
  • 输入电压范围:4.5V ~ 18V
  • 输出电流:最大 3A(在适当散热条件下)
  • 开关频率:典型 600kHz(高频有利于减小外部被动元件体积)
  • 静态电流(Iq):典型 300µA(有利于待机节能)
  • 工作温度范围(结温 TJ):-40°C ~ +125°C
  • 封装:SOT-23-6(小尺寸,便于空间受限设计)
  • 开关管:内置(简化驱动与布线设计)

三、功能与防护(常见项)

为保证系统可靠性并简化外围电路,TMI3253 在实际应用中通常集成或支持以下功能(依据具体型号与版本,请参考器件数据手册):

  • 过流保护(限流或恒流限制)
  • 过热保护(热关断)
  • 软启动(限制启动浪涌电流,避免输入瞬态)
  • 使能/关断引脚(EN)用于功耗管理
  • 欠压锁定(UVLO)保证上电行为稳定

四、典型应用场景

  • 汽车电子子系统(车载电源、车载摄像头等,配合车规范围使用需确认具体车规版本)
  • 工业控制模块与传感器供电
  • 通信设备的本地稳压电源
  • 便携或电池供电设备的中高效率降压转换
  • MCU、FPGA、模拟前端等的电源供给

五、设计注意事项与建议

  1. 输入与输出电容:为保持稳定性与良好瞬态响应,建议使用低 ESR 的陶瓷电容作为输入与输出滤波(例如 X5R/X7R 类),在输入侧靠近 VIN 引脚放置足够电容以抑制输入纹波和开关噪声;输出侧选择合适容量与电容并联组合以满足纹波与瞬态要求。
  2. 电感选型:600kHz 的工作频率允许使用较小体积的电感,选型应兼顾直流电阻(DCR)、饱和电流和效率。确保电感额定电流能覆盖最大负载和峰值电流。
  3. 布局与布线:开关节点(SW)、输入电容、功率地与感性元件之间的回流路径要尽可能短,减小环路面积以降低辐射与噪声。将反馈分压器尽可能靠近器件的 FB/COMP 引脚放置,避免噪声耦合影响稳压精度。
  4. 散热管理:SOT-23-6 封装热阻相对较高,长期满载时需要评估 PCB 铜面积与散热路径。增加 VIN/GND 处的铜皮或热 vias 可显著改善热性能,提高持续输出能力。
  5. 稳定性与补偿:若器件提供外部补偿引脚(或内置补偿),按照数据手册推荐的 L、C、Cout 组合和补偿网络进行设计,保证环路稳定性与响应速度。
  6. EMC 与滤波:高频开关器件在系统级可能引起 EMI 问题,必要时在输入端增加共模/差模滤波并优化布局与地平面。

六、典型电路与外围器件

TMI3253 的典型应用电路通常包括:VIN、输入滤波电容、TMI3253、外部电感、输出电容、输出电阻分压(用于设定输出电压)、以及补偿/软启动/使能电路(若需要)。由于器件频率较高,可选用 1µH ~ 数 µH 级的电感与适当的输出容值以平衡纹波与瞬态性能。具体元件值与电路拓扑请参照官方数据手册与参考设计。

七、总结

TMI3253 以其宽输入电压范围、内置同步开关、600kHz 高频率与 3A 输出能力,为空间受限且对效率与待机功耗有要求的嵌入式系统提供了一个紧凑、高效的降压解决方案。在实际应用中,合理选择电感与低 ESR 电容、优化 PCB 布局与散热设计,能使器件在额定条件下稳定、高效运行。欲获得完整电气特性曲线、引脚定义、典型应用电路以及布板注意事项,请参阅 TMI 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.