WMSIC Electronic Components

TMI TMI3108

ModelTMI3108
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3108
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3108
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.022g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226612929
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component
Output Voltage
600mV~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3108 产品概述

一、概述

TMI3108 是拓尔微(TMI)推出的一款降压型同步开关稳压器,面向体积受限且需高效率供电的便携与嵌入式应用。器件输入电压范围宽(2.5V~5.5V),输出可调(0.6V~5.5V),最大输出电流可达1A,内部集成开关管并采用同步整流,工作温度范围为 -40℃~+125℃(TJ),封装为 SOT-23-5,静态电流仅 50µA,开关频率高达 1.5MHz,便于实现小尺寸外部被动元件和快速瞬态响应。

二、主要特性

  • 降压拓扑,输入电压:2.5V~5.5V
  • 输出电压可调:0.6V~5.5V,最高输出电流 1A
  • 开关频率 1.5MHz,内置同步整流 MOSFET(无须外接肖特基)
  • 低静态电流 Iq = 50µA,适合低功耗与待机场景
  • 内置开关管(简化外部驱动),封装 SOT-23-5,工作温度 -40~125℃

三、电气与性能要点

TMI3108 的高开关频率使得电感、电容等滤波元件尺寸可显著减小,适合空间受限的移动设备和便携式仪器。同步整流提升轻负载到中等负载下的转换效率并降低热耗。输出通过外部分压器设定,最小输出电压 0.6V,支持多种电源轨设计。实际效率与输入/输出电压差、负载电流、外部元件品质(电感 DCR、输出电容 ESR)密切相关,PCB 散热与布局对连续 1A 输出时的热管理尤为重要。

四、典型应用

  • 手机配件与可穿戴设备供电
  • 单节锂电池或 USB 电源降压(2.5V~5.5V 输入)
  • 工业控制模块、传感器供电与电压轨生成
  • 蓝牙/无线模块、MCU 供电

五、设计与布局建议

  • 推荐选用低 DCR 的功率电感(典型 1µH~2.2µH,视纹波电流与效率权衡),并选择低 ESR 的陶瓷输出电容(多层 MLCC)。
  • 输入电容靠近 VIN 到 GND 布局,开关节点(SW)与电感、二极管/同步管回流路径布线尽量短、宽,减少寄生电感与辐射。
  • SOT-23-5 封装散热有限,长时间 1A 输出需评估 PCB 散热面积并使用多层地平面。
  • 调整输出电压时注意分压器阻值(避免过高造成噪声敏感,过低增加静态消耗),并参考数据手册进行软启动、保护参数验证。
  • 高频工作下注意 EMI 管理,必要时加输入滤波与 PCB 屏蔽。

六、封装与资料

器件封装:SOT-23-5,适合小型化电路板布局。欲获得完整引脚定义、电气特性曲线、评估板参考设计与典型应用电路,请参考 TMI3108 数据手册与厂商参考设计文件,以确保满足系统的热、稳态与瞬态性能需求。

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