WMSIC Electronic Components

TMI TMI32530

ModelTMI32530
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI32530
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI32530
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.06g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0238667547
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~18V
Switching Frequency
1MHz;850kHz~1.1MHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI32530 产品概述

TMI32530 是拓尔微(TMI)推出的一款高集成度降压型开关稳压器,采用降压拓扑并内置功率开关,支持同步整流,适用于对体积、效率与成本有较高要求的单通道电源设计。器件工作电压范围宽(4.5V ~ 18V),输出电流能力达 3A,开关频率典型值为 1MHz(工作范围 850kHz ~ 1.1MHz),工作结温 -40℃ ~ +125℃,静态电流仅 350µA,输出可调,封装为 SOT-23-6,便于小体积应用部署。

一、主要特性

  • 功能类型:降压型(Buck)
  • 输入电压范围:4.5V ~ 18V
  • 最大输出电流:3A(连续)
  • 开关频率:典型 1MHz(850kHz ~ 1.1MHz)
  • 同步整流:内置同步整流,提高轻载与重载效率
  • 静态电流:Iq = 350µA(低静态功耗,适合节能应用)
  • 输出类型:可调(外接电阻设定输出电压)
  • 开关管:内置功率开关,简化外部布局与BOM
  • 封装:SOT-23-6,适合空间受限的消费与工业设备
  • 工作温度:-40℃ ~ +125℃(以结温为准)

二、典型应用场景

  • 工业控制与嵌入式系统电源
  • 通信设备、路由器与网关的局部降压
  • 便携式设备与仪表的辅助电源
  • 汽车电子(符合温度等级需求的外围设计)
  • 电池供电系统中的高效降压子模块

三、典型电路与设计要点

  • 输出设置通过外部分压电阻设定,配合反馈引脚实现精确输出调节。
  • 建议采用 1MHz 级开关频率优势:外围电感、电容体积小、快速瞬态响应;但需注意开关损耗与电磁兼容(EMC)设计。
  • 常用电感范围可选 0.47µH ~ 2.2µH,依据输出纹波电流与效率权衡;选择低直流电阻(DCR)且饱和电流高于峰值电流的器件。
  • 输出电容建议采用低 ESR 的多层陶瓷电容并联适量电解或固态电容以优化稳定性与纹波抑制。

四、布局与散热建议

  • 输入电容应尽量靠近 VIN 与 GND 引脚布局,缩短回流环路,降低 EMI。
  • 开关节点(SW)走线尽量短且远离敏感模拟线与反馈线,减小辐射耦合。
  • SOT-23-6 封装在 3A 级别输出时需良好 PCB 散热:在器件下方或周围设计宽铜箔与散热过孔,提升热扩散能力。
  • 反馈网络走线应避开噪声源,并与地平面良好连接,保障稳定精度。

五、典型性能与注意事项

  • 同步整流结构在重载和轻载下都能提供较高效率,但在轻载极低输出时仍需关注自耗与循环模式。
  • 由于高开关频率,板级 EMI 管理(走线、滤波与接地)非常重要,必要时添加输入滤波与输出 LC 滤波优化。
  • 详尽保护特性(过流、过热、软启动、短路等)请参照器件数据手册进行系统级可靠性验证与设计。

六、总结

TMI32530 以其宽输入、3A 输出能力、高集成度与 1MHz 工作频率,适合在对体积、成本和效率要求并重的应用中作为主电源或辅电源解决方案。合理选型电感与电容、优化 PCB 布局与散热,是发挥其性能并保证长期可靠工作的关键。若需进一步的参考电路、典型效率曲线或保护参数,建议查阅官方数据手册或联系拓尔微技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.