Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TMI TMI8150B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI8150B
- Type
- TMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI8150B
- Electronic Component
- 1
- Package
- QFN-20L-EP(3x3)
- Electronic Component
- Stepper Motor Driver IC
- Electronic Component
- 0.13g
- Electronic Component
- 1
- H
- 5
- Features
- Motor
- Electronic Component
- BM0258505246
- Resistor
- 1.3Ω
- Operating Temperature
- 40℃~+85℃
- Interface Type
- SPI
- Voltage
- 1.8V~5.5V
- Electronic Component
- 512
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI8150B 产品概述
一、概述
TMI8150B 是拓尔微（TMI）面向微型步进电机驱动的高集成器件，适合在体积受限且对运动平滑性有较高要求的场合使用。器件支持广泛的控制电压与驱动电压范围，提供高精度的细分步进能力和数字化接口配置，方便嵌入式系统集成与精确运动控制。
二、主要规格参数
- 控制电压（VCC）：1.8V ~ 5.5V，兼容多种MCU电平
- 电机驱动电压（Vm）：2.5V ~ 5.5V，适合小电压电池或系统供电
- 单通道输出电流：最高700mA（需按热设计与封装散热能力规划）
- 步进细分：最高512细分，支持超平滑定位与低噪声运行
- 通信接口：SPI，便于寄存器级配置与实时参数调整
- 导通电阻（Rds(on)）：1.3Ω（典型/最大视资料），有利于降低功耗与发热
- 工作温度范围：-40°C ~ +85°C，满足工业级温度应用
- 封装：QFN-20L-EP (3x3)，小尺寸并带底面散热焊盘
三、性能亮点
- 高细分：512细分显著提高步进平滑度，减少振动和噪声，适合对定位精度和静音要求高的场景。
- 宽电压兼容性：1.8V5.5V 控制侧及 2.5V5.5V 驱动侧，便于与各类MCU与电源体系配合。
- SPI 配置：通过数字接口可灵活设置运行参数，方便嵌入到智能控制平台。
- 小封装高集成：QFN-20L-EP(3x3) 适合空间受限的产品设计，同时底部散热焊盘利于热传导到 PCB。
四、典型应用场景
- 相机对焦/光圈模组、消费类小型云台
- 工业微型执行器、精密定位装置
- 便携式打印、标签机、医疗检测仪器中的微步驱动
- 智能家居、穿戴类设备中需要精确而低噪的运动控制场合
五、设计与布局建议
- 电源去耦：在 Vm 近端放置 0.1µF 陶瓷去耦并配合 4.7~47µF 的低ESR 电解/钽电容作为储能，减小电压下降与脉冲干扰。
- 散热处理：器件底部的EP焊盘应与大面积铜箔连接，采用多层过孔通孔至内层/底层散热层，保证在高占空比下的热耗散。
- 信号走线：SPI 及使能/步进控制线尽量短且并行避免长串阻抗，必要时在信号线上加入小阻抗匹配或滤波以抑制干扰。
- 电磁兼容：电机线路应使用分离走线并加装滤波器或磁珠，减少噪声对控制侧的影响。
六、热与可靠性注意事项
- 700mA 为器件最高输出能力，实际持续电流应根据 PCB 散热、环境温度和占空比进行适当降额。
- 在高温或长时间运行场景下，需评估封装结温并采取被动或主动散热措施以保证长期可靠性。
七、总结
TMI8150B 以其高细分、宽电压兼容和紧凑封装，适合各种要求安静、精确控制的小功率步进电机应用。合理的 PCB 布局与热设计能充分发挥其性能，为终端产品提供平顺、可靠的运动控制方案。若需具体寄存器、引脚定义或典型应用电路，请参考厂商详细数据手册或联系技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
