WMSIC Electronic Components

TMI TMI2283QE

ModelTMI2283QE
PackageSOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI2283QE
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI2283QE
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.19g
Electronic Component
1
Features
EMI Optimization
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258742083
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~30V
Switching Frequency
270kHz;120kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI2283QE 产品概述

一、产品简介

TMI2283QE 是一款高集成度的降压型同步整流开关稳压器,采用降压(Buck)拓扑、单输出通道设计,封装为 SOP-8。芯片内置功率开关,输入电压范围宽,支持 4.5V 到 30V 工作;可调输出、最高输出电流 3.5A,适合对效率和体积有要求的中高功率点对点供电场合。器件工作温度范围宽(-40℃ 到 +125℃,按结温 TJ 计),静态电流(Iq)仅 800μA,适合对静态能耗敏感的应用。

二、主要特性

  • 输入电压:4.5V ~ 30V,适用较宽的电源轨与多种蓄电池/适配器供电场景。
  • 输出电流:最大 3.5A(需参考实际散热与 PCB 布局条件)。
  • 开关频率:可选/典型值 270kHz 或 120kHz(便于在效率与外部元件尺寸之间取舍)。
  • 拓扑:同步整流降压(内置开关管),减小整流损耗、提升轻负载与重载效率。
  • 输出类型:可调,外接分压电阻设定输出电压。
  • 静态电流:Iq = 800μA,空载损耗低,有利于省电设计。
  • 工作温度:-40℃ ~ +125℃(TJ),适合工业/商用环境。
  • 封装:SOP-8,便于手工焊接与常规贴片工艺。

三、典型应用场景

  • 工业控制和自动化装置的点对点电源。
  • 通信设备、网关或交换机的局部供电。
  • 电池供电系统或便携设备(需注意热管理与效率)。
  • 汽车电子(需在满足相应车规认证与 EMC、ESD 要求下使用)。
  • 各类消费类电子、仪器仪表的降压转换子模块。

四、设计与选型要点

  • 开关频率选择:270kHz 倾向于减小输出电感和电容体积,适合体积受限的设计;120kHz 有利于降低开关损耗、改善轻载效率与热性能。根据目标效率与外围元件尺寸权衡选择频率。
  • 电感选择:选型时应保证电感的饱和电流高于最大输出电流(建议留 20%~50% 余量),DCR 尽可能低以减少 conduction loss;频率越高可选电感值越小。
  • 输入/输出电容:推荐使用低 ESR 陶瓷电容(X5R/X7R)作为主滤波;输入电容靠近芯片 VIN 与 GND 布局,以抑制峰值电流与减少 EMI。输出电容需兼顾容值与 ESR 来满足负载瞬态响应。
  • 分压/补偿:输出电压通过外部分压实现,具体反馈网络、补偿元件配置请参照器件手册,确保环路稳定性与所需瞬态性能。
  • 热管理与布局:SOP-8 封装的散热依赖于铜箔面积与走线,建议在 PCB 底层增加大面积铜箔并使用热沉或过孔分散热量;切忌将高电流回路走线过长,开关节点(SW)、输入电容、功率电感应尽量靠近布置,形成最小回路面积以降低 EMI。
  • 保护与可靠性:虽然器件内置多种功能以简化外部电路(如同步整流以提升效率),但具体是否含有过流保护、过温保护、软启动等功能需以官方数据手册为准;实际设计中仍建议配合熔丝、电流检测或外部保护电路提高系统安全性。

五、使用建议与验证要点

  • 在样机阶段重点验证温升、效率曲线(不同输入/输出/负载点)、瞬态响应与稳定性。
  • 进行 EMI 测试并通过 PCB 布局与滤波器调整以满足系统级要求。
  • 输出稳压精度与启动/关断行为在不同环境温度下验证,确认满足产品规格。
  • 最终设计前务必参照 TMI(拓尔微)官方数据手册与应用笔记,获取完整引脚定义、典型电路、推荐外部元件及完整保护功能说明。

总结:TMI2283QE 以其宽输入电压、3.5A 输出能力、同步整流与较低静态电流的组合,适合多种工业与商用降压供电场景。正确的外围元件选择与良好的 PCB 布局是发挥器件性能的关键。请在设计前仔细阅读官方数据手册并进行必要的样机验证。

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