WMSIC Electronic Components

TMI TMI8110

ModelTMI8110
PackageESOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI8110
Type
TMI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI8110
Electronic Component
1
Package
ESOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.19g
Electronic Component
1
Integrated FET
Electronic Component
H
1
Features
Current Sampling
Electronic Component
BM0257364265
Resistor
250mΩ
Current
3.5A
Operating Temperature
40℃~+150℃
Operating Voltage
4.5V~37V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI8110 产品概述

一、产品简介

TMI8110 是拓尔微(TMI)推出的一款集成功率场效应管的单通道 H 桥驱动器,封装为 ESOP-8。器件面向驱动小功率直流电机、执行器与感性负载的场合,集成 FET 可简化外部电路设计,适合资源受限与体积敏感的应用。

二、主要参数与特点

  • 集成 FET:是(内置高低侧功率 MOSFET,构成一组 H 桥)
  • H 桥数量:1
  • 峰值电流:3.5 A(瞬态峰值,可用于短时启动或冲击负载)
  • 工作电压:4.5 V ~ 37 V,覆盖汽车 12V/24V 与工业 24V 等宽范围
  • 导通电阻(Rds(on)):250 mΩ(典型)
  • 静态电流(Iq):5 μA,适合低功耗待机场合
  • 工作温度:-40 ℃ ~ +150 ℃,适应严苛环境
  • 封装:ESOP-8,便于 PCB 安装与散热设计

三、应用场景

适用于微型直流电机、步进电机切换驱动、锁定机构、阀门、继电器替代驱动以及便携式与汽车电子中等功率控制场合。低待机电流使其在电池供电设备中更具优势。

四、设计与使用建议

  • 功耗与散热:在峰值电流下,单臂导通功耗约为 P ≈ I^2·R ≈ 3.5^2×0.25 ≈ 3.1 W,连续高电流工作时需评估结温并通过铜厚、热 vias 或外部散热片降低结温。合理安排 PCB 散热区、加大 GND 与 VCC 的铜箔面积。
  • 电源去耦:在靠近器件的电源引脚处放置低 ESR 电容(如 10 μF 与 0.1 μF 并联),减少瞬态电压跌落与噪声。
  • 感性负载保护:尽管 FET 本体具有体二极管,对回流有一定容忍,仍建议为大型感性负载采用合适的续流路径或额外吸收网络(RC 或 TVS),以保护器件免受过压冲击。
  • PWM 与死区时间:驱动 PWM 时确保适当死区时间以防止高低侧直通。若需精准电流控制,应在电路中加入电流检测与限流方案。
  • 工作模式与保护:在设计中预留过流、过温与欠压检测策略;具体器件内建保护功能请参阅官方数据手册并按手册建议使用。

五、封装与可靠性

ESOP-8 封装利于自动化贴装与热管理。器件工作温度范围宽,适合汽车级与工业级产品,但在长期可靠性设计中要考虑热循环、焊接工艺与散热设计对寿命的影响。

六、总结

TMI8110 以其集成 FET、宽工作电压、低静态电流与适应高温环境的特性,适合对体积、功耗和环境适应性有要求的中等功率驱动场合。为确保长期可靠运行,应重点关注 PCB 散热、电源去耦与感性负载的过压保护,并参考详细数据手册完成最终电路与布局验证。

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