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TMI TMI3258
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI3258
- Type
- TMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI3258
- Electronic Component
- 1
- Package
- SOT-563
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0264606643
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 4.5V~18V
- Switching Frequency
- 500kHz~700kHz
- Electronic Component
- Electronic Component
- Output Current
- 3A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI3258 产品概述
一、器件概述
TMI3258 是一款降压型同步整流开关稳压器，输入电压范围宽（4.5V～18V），输出电流最高可达 3A，开关频率在 500kHz～700kHz 之间（典型值约 600kHz）。器件采用降压拓扑并内置功率开关，静态工作电流仅 300µA，输出为可调类型，工作温度范围为 -40℃～+125℃，封装为小尺寸 SOT-563，适合对体积和效率有双重要求的电源设计。
二、主要特性
- 宽输入电压：4.5V ～ 18V，适配多种车载和工业电源轨
- 输出能力：最大 3A 连续输出，内置功率开关，简化外部功率器件布局
- 高频工作：500kHz～700kHz 的开关频率，有利于减小外部电感和滤波电容体积
- 低静态电流：Iq ≈ 300µA，有利于待机节能
- 同步整流：提高轻载及中载效率，降低二次整流损耗
- 可调输出：通过外部电阻分压器设定输出电压，适配多种负载需求
- 宽温适应：-40℃ ～ +125℃，适合工业/车载环境
- 封装小型化：SOT-563，有利于空间受限的终端产品
三、典型应用场景
- 工业控制供电模块、分布式电源管理
- 汽车电子（非关键安全回路）、车载辅助电源（需依据车规做额外验证）
- 通信设备、消费类便携设备的主从电源降压场合
- 智能家居与物联网终端的低功耗稳压方案
四、设计与布局要点
- 输入电容需靠近 VIN 与 GND 引脚布局，降低寄生感抗和纹波；建议低 ESR MLCC 与必要的钽/电解并联
- 输出滤波器选型：根据开关频率与输出电流选择电感（一般 2.2µH ～ 4.7µH 范围）与低 ESR 输出电容，以平衡瞬态响应与稳定性
- 布局优先级：功率回路走短、粗的铜迹；反馈网络与参考点应远离开关节点，反馈走线尽量短且靠近 IC
- 散热措施：SOT-563 封装热阻相对较高，需合理的 PCB 热铜面积与过孔散热，必要时增加底铜和散热通孔
- EMI 控制：合理安放输入电感、RC/LC 滤波网络并做好接地分割，降低开关噪声对系统敏感电路干扰
五、可靠性与保护建议
TMI3258 适配常见电源保护需求，设计时建议配合下列措施以提高系统鲁棒性：
- 输入端加 TVS 或浪涌抑制器，防止瞬态大电压损坏器件
- 输出并联短路/过流检测电路或使用外部保险元件以应对异常短路
- PCB 热设计与器件降额使用，保证高温环境下的长期可靠性
六、选型理由与注意事项
- 若系统要求小体积、高效率且待机低功耗，TMI3258 提供较好的折衷：高开关频率降低滤波元件体积、同步整流提升效率、低静态电流利于省电
- 由于封装与热能力限制，在接近 3A 的工作点或高环境温度时需重点评估温升与热降额，必要时在 PCB 上扩铜或考虑更大封装方案
- 输出精度、瞬态响应及外部元件选择会直接影响最终性能，建议在样片验证阶段通过不同电感、电容组合进行调优
总体而言，TMI3258 适合对空间与效率有双重要求的中高电流降压应用，设计时以良好 PCB 布局和热管理为关键，可在多种工业与消费场景中实现稳定、经济的电源解决方案。
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