WMSIC Electronic Components

TMI TMI6030C-30 TMI6030C

ModelTMI6030C-30
PackageSOT-23
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI6030C-30
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
320mV@(300mA)
Electronic Component
TMI
Electronic Component
TMI6030C-30
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0258507095
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3V
Output Current
300mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI6030C-30 产品概述

一、用途与概述

TMI6030C-30 是拓尔微(TMI)推出的一款高性能固定输出线性稳压器,输出电压为 3.0V,面向便携设备和工业电子等需要稳定低噪声电源的场合。该器件采用 SOT-23 小型封装,单通道输出,支持最高 300mA 的输出电流,内置多重保护电路(过流保护、短路保护与热关断),在工业级温度范围内可靠工作(-40℃ 至 +125℃,结温 Tj 标准)。器件在 1kHz 时具有优异的电源纹波抑制能力(PSRR = 70dB),适合为对噪声敏感的模拟、电源或射频前端模块提供稳压电源。

二、主要性能参数

  • 输出类型:固定(3.0V)
  • 最大工作电压(输入):5.5V
  • 最大输出电流:300mA
  • 压降(Dropout):320mV @ 300mA(即在满载时 Vin 至少高于 Vout ≈ 0.32V)
  • PSRR:70dB @ 1kHz(优良的纹波抑制)
  • 保护功能:过流保护(OCP)、短路保护(SCP)、热关断(Thermal Shutdown)
  • 工作温度范围:-40℃ ~ +125℃(Tj)
  • 输出极性:正极输出
  • 输出通道数:1
  • 封装:SOT-23(常见 3 引脚布局)

三、功能亮点

  • 高 PSRR:在 1kHz 可达 70dB,显著减少来自输入电源的纹波和干扰对敏感负载的影响。
  • 低压差:满载时仅 320mV 的压差,适用于电源压差受限的系统(例如当供电电压接近目标 3.0V 时)。
  • 完整保护机制:内置 OCP/SCP 和热关断,提升系统可靠性并减少外部保护电路需求。
  • 小尺寸封装:SOT-23 有利于空间受限的 PCB 布局和批量成本控制。

四、引脚与封装(概述)

  • 标准 3 引脚 SOT-23:
    • IN:输入电源
    • GND:地
    • OUT:稳压输出(3.0V)
  • 封装尺寸小、便于自动化贴装。建议在实际设计前参考器件的机械封装图和 PCB 封装模板以保证焊接可靠性。

五、电源与热管理建议

  • 输入电压要求:为保证在满载时正常稳压,输入电压应高于 Vout + Dropout(例如:3.0V + 0.32V = ≥3.32V)。器件最大允许输入电压为 5.5V,设计时请留有裕量。
  • 功耗估算:器件功耗约等于 (Vin – Vout) × Iout。举例:若 Vin = 5.0V,Iout = 300mA,则 Pd ≈ (5.0 – 3.0) × 0.3 = 0.6W。SOT-23 封装散热能力有限,建议在高 Vin 或高负载情况下做热管理并适当降额使用。
  • 散热措施:在 PCB 上增加铜箔散热区,扩大 GND 平面并通过热过孔连接多层铜层,可显著降低结温并提高输出电流能力。

六、外部元件与布局建议

  • 输入电容:建议在 IN 引脚附近放置 1µF~10µF 的低 ESR 陶瓷电容(X5R/X7R),以抑制输入瞬态与提高稳定性。
  • 输出电容:为确保稳压器稳定并获得良好瞬态响应,建议在 OUT 引脚附近放置 1µF10µF 的低 ESR 陶瓷电容。实际容量与 ESR 要求请参考器件应用说明书;若出现振荡,可适当增加电容或在输出串联小阻值(10mΩ50mΩ)以改善稳定性。
  • 布局原则:
    • 输入电容与输出电容尽量靠近相应引脚安装,走短而粗的走线。
    • GND 建议采用单点或短支路连接到器件地脚,尽量减少地回路阻抗。
    • 将噪声敏感的模拟信号与稳压器高电流回路分离,避免电源回流影响精密电路。

七、典型应用场景

  • 便携式终端与消费电子(MCU、传感器供电)
  • 工业控制模块与传感节点
  • 模拟前端、ADC/DAC 的低噪声电源
  • 射频前端偏置与中低功率模块供电

八、设计注意事项

  • 在高环境温度或高输入差时,应对输出电流进行热降额设计,避免触发热关断。
  • 系统在启动/关断过程可能出现瞬态,需评估对上游电源和下游负载的影响,必要时增加软启动或旁路电路。
  • 若对噪声和纹波有更严格要求,可结合输入滤波与良好 PCB 设计获得最佳性能。

如需更详细的电气特性曲线、稳态与瞬态响应、封装尺寸和推荐 PCB footprint,请参阅 TMI6030C-30 的完整数据手册或联系厂商技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.