Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TMI STI9287B
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI STI9287B
- Type
- TMI
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- STI9287B
- Electronic Component
- 1
- Package
- SOT-23-6
- Type
- DC-DC
- Electronic Component
- LEDDriver
- Electronic Component
- PWM; Analog
- Electronic Component
- 0.05g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- (OVP); Built-in; (OTP)
- Electronic Component
- BM0258344438
- Operating Temperature
- 40℃~+125℃
- Switching Frequency
- 1MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
STI9287B 产品概述
一、产品简介
STI9287B 是拓尔微（TMI）推出的一款高集成度单通道升压型LED驱动芯片，集成开关管并工作在1MHz固定开关频率。器件输入电压范围宽（DC 2.5V ~ 7V），工作温度范围宽（-40℃ ~ +125℃），适用于便携类手电、移动终端背光、单节锂电驱动高亮LED等需要在窄小空间内实现升压恒流驱动的场景。器件采用SOT-23-6小封装，便于空间受限的PCB布局与批量生产。
二、主要规格
- 工作电压（DC）：2.5V ~ 7V
- 开关频率：1MHz（固定）
- 通道数：1（单通道）
- 调光方式：PWM调光 / 模拟调光
- 拓扑结构：升压（Boost）
- 开关管：内部集成（内置MOSFET）
- 封装：SOT-23-6
- 工作温度：-40℃ ~ +125℃
三、功能与保护
STI9287B 集成多项实用功能以保证可靠性与使用安全：
- 过流保护（OCP）：限制输出电流峰值，防止负载短路或异常电流导致器件损坏。
- 过温保护（OTP）：在芯片温度异常升高时进行自动保护，必要时进入热关断并在温度恢复后重启。
- 过压保护（OVP）与欠压保护（UVP）：监测输入/输出工作点，防止过电压或欠压工况损害器件或外部负载。
- PWM/模拟调光：支持通过PWM信号实现高对比度调光，也支持模拟电压调整输出亮度，便于与各种MCU或模拟控制电路配合。
四、封装与引脚
STI9287B 采用SOT-23-6封装，适合小外形应用。引脚布置通常包含电源、开关节点、反馈/调光输入、地以及必要的参考/使能脚。设计时请按器件数据手册核对具体引脚功能，确保电源旁路、电感、输出电容和接地网络布局合理。
五、典型应用场景
- 手持照明（手电、营光灯）
- 手机/平板/可穿戴设备的高亮LED驱动
- 相机补光与闪光灯管控（连续与脉冲场景）
- 工业指示与背光驱动，要求宽输入电压与高可靠性的小型解决方案
六、设计与布局建议
- 开关频率为1MHz，可使用体积更小的电感与陶瓷电容，利于紧凑设计，但要关注开关损耗与磁芯损耗。
- 电感选型：选用饱和电流高于预计峰值电流的低DCR电感，保证效率与温升控制。
- 电容与二极管：输入/输出选用低ESR陶瓷电容，开关节点旁布局短且回路小；若电路需要外置整流二极管（视器件是否为同步结构），优先选择低正向压降的肖特基二极管以降低损耗。
- 布局要点：将SW、L、二极管（如有）、Cout构成的开关回路尽可能缩短循环面积；接地采用单点或加大铜皮散热；输入电容靠近VCC与GND引脚。
- 热管理：SOT-23-6 封装可通过底层大铜箔、热过孔与散热铜皮来导出热量，设计时应考虑在高功率或高潮温环境下的降容使用。
七、可靠性与应用提示
- 在实际产品前请参照官方数据手册完成电气特性、启动/保护阈值与时序的验证。
- 对于需通过PWM进行闪光或快速调光的场合，验证PWM频率与占空比范围对热性能及LED驱动稳定性的影响。
- 设计输入滤波与瞬态抑制以应对电磁兼容（EMC）与车规或工业级电压扰动（如有此类应用需求，应评估器件合规性）。
如果需要，我可以根据目标应用（如单节锂电手电或移动设备背光）给出参考外部元件选型与典型电路图建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
