WMSIC Electronic Components

TMI TMI6030C-28 TMI6030C

ModelTMI6030C-28
PackageSOT-23
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI6030C-28
Type
TMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
320mV@(300mA)
Electronic Component
TMI
Electronic Component
TMI6030C-28
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0258506679
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.8V
Output Current
300mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI6030C-28 产品概述

一、产品简介

TMI6030C-28 是拓尔微(TMI)推出的一款低压差固定输出线性稳压器(LDO),输出电压为 2.8V,面向对噪声、稳定性和保护功能有较高要求的便携与嵌入式系统。器件采用 SOT-23 小封装,单通道输出,最大输出电流可达 300mA,适合为 MCU、传感器、射频前端、小功率模数混合电路等供电使用。

二、主要技术参数

  • 输出类型:固定输出(2.8V)
  • 工作电压(输入):最高 5.5V
  • 输出电流:最大 300mA
  • 压差(Dropout):320mV @ 300mA
  • 电源纹波抑制比(PSRR):70dB @ 1kHz
  • 输出极性:正极
  • 输出通道数:1
  • 工作温度范围:-40℃ ~ +125℃(Tj)
  • 封装:SOT-23
  • 保护特性:过流保护、短路保护、热关断

三、功能与保护

TMI6030C-28 集成多重保护机制,提高系统可靠性:

  • 过流保护(OCP):在输出过载时限制输出电流,防止器件与负载损坏。
  • 短路保护(SCP):在输出短路情况下提供限流或热限制,快速响应。
  • 热关断(Thermal Shutdown):当结温超过安全阈值时自动断开输出,降温后可复位恢复。

此外,器件具有良好的 PSRR(70dB @1kHz),能有效抑制输入电源的噪声和纹波,利于敏感模拟/射频电路的稳定工作。

四、典型应用场景

  • 便携式终端、移动设备的核心供电
  • 单片机(MCU)和数字逻辑电路供电
  • 传感器供电与前端模拟电路
  • 射频前端和混合信号板中对低噪声电源的局部供电
  • 工业控制与消费电子小功率稳压需求场合

五、使用建议与注意事项

  • 输入电压应高于 2.8V 且不超过器件允许的最大工作电压(5.5V);在大电流输出情况下,请计算压降导致的功耗:Pd = (Vin - 2.8V) × Iout,并根据 PCB 布局与散热能力确认结温不超过规定范围。
  • 输出电容对 LDO 的稳定性与瞬态响应至关重要。建议使用低 ESR 的陶瓷电容(如 X7R)作为输出滤波,典型取值范围为 1µF ~ 10µF;输入端建议并联 0.1µF 至 1µF 陶瓷电容做去耦,尽量靠近器件引脚布置。
  • 布局建议:输入/输出电容靠近引脚放置,尽量缩短导线长度与环路面积;SOT-23 封装散热能力有限,注意在高功耗工况下加大铜箔面积或使用散热通道以降低结温。
  • 启动与瞬态:在有较大负载瞬态时,合适的输出旁路与布线能改善输出压摆与震荡风险,必要时可在输出加小阻抗串联或添加吸收元件以优化稳定性。
  • 保护与可靠性:在持续高温或长期满载工况下,应留有裕量运行(降额设计),以保证长期可靠性。

六、封装与采购信息

TMI6030C-28 采用常见的 SOT-23 小封装,适合空间受限的板级应用。产品由拓尔微(TMI)生产,适合批量采购与工程样机验证。具体封装引脚定义、典型外形尺寸和完整电气特性曲线请参考厂家数据手册以获得详细参数与应用电路建议。

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