WMSIC Electronic Components

TMI TMI3341

ModelTMI3341
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3341
Type
TMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3341
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.06g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258499737
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~30V
Switching Frequency
1.2MHz~1.8MHz
Electronic Component
Electronic Component
Output Current
1.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3341 降压型 DC-DC 稳压器 产品概述

一、产品简介

TMI3341 是一款降压(Buck)型开关稳压器,工作电压范围宽(4.5V~30V),输出电流可达 1.2A,开关频率位于 1.2MHz~1.8MHz 之间,采用同步整流并内置开关管,输出为可调类型。器件封装为 SOT-23-6,工作结温范围为 -40℃~+125℃,静态电流(Iq)约为 350μA,适合对体积、效率和成本有综合要求的中小电流电源应用。

二、主要特性

  • 输入电压宽:4.5V 至 30V,适配汽车、工业及通信供电总线等场景。
  • 输出电流:最高 1.2A,适合中等负载设备。
  • 高开关频率:1.2MHz~1.8MHz,有利于使用小型电感与输出电容,减小整体 PCB 面积。
  • 同步整流:提高效率,尤其在中高负载时优于整流二极管方案。
  • 低静态电流:Iq ≈ 350μA,有利于轻载时能耗控制。
  • 封装:SOT-23-6,便于批量生产与常规 SMT 工艺。

三、典型应用

  • 工业与通信设备的局部稳压电源
  • 汽车电子(非关键安全回路)和车载附件(需核对 AEC 要求)
  • 嵌入式系统、单板机及外设供电
  • 电池供电的便携设备(注意轻负载效率与启动特性)
  • LED 驱动与传感器供电(在允许范围内)

四、设计要点与选型建议

  • 电感:由于工作频率较高,可选体积较小的功率电感;选型时确保电感饱和电流高于系统峰值电流,并优先选用低 DCR 以降低损耗。
  • 输入/输出电容:推荐使用低 ESR 的陶瓷电容(例如 X5R/X7R),输入电容要靠近器件 VIN 引脚,输出端需考虑容差与稳定性。
  • 反馈与可调输出:器件为可调输出,通过外部分压电阻设置目标电压,注意分压电阻的阻值范围会影响静态电流与噪声抗扰性。
  • 开关频率权衡:高频有利于小元件和体积,但会带来更高开关损耗与 EMI,需根据效率与 EMI 要求在 1.2MHz~1.8MHz 区间权衡。
  • 热设计与布局:SOT-23-6 封装热阻相对较高,需在 PCB 上提供充足铜箔散热并缩短功率回路环路(VIN、SW、GND、CIN、L、COUT 路径);若大电流长期工作,建议在器件周围增加铜面或采用过孔导热到内部层。
  • EMI 与滤波:高开关频率需要注意辐射与传导 EMI,合理布置地线、增加输入滤波或软启动/频谱扩展等手段可降低辐射。

五、封装与可靠性

TMI3341 采用 SOT-23-6 小型封装,便于在空间受限的消费类与工业板卡上使用。器件规定工作结温 -40℃~+125℃,适用于宽温环境。实际可靠性与寿命评估应参考器件数据手册中的热参数与典型应用测试。

六、典型电路与注意事项

典型降压拓扑包含:VIN、CIN(旁路陶瓷)→ 内置开关 → 电感 L → COUT → 负载,反馈回路从输出经分压电阻回到 FB 引脚以设定输出电压。同步整流免去了外部肖特基二极管,但注意在开关转换瞬间的布局和布线,避免大电流环路产生噪声。调试阶段建议观察波形(SW、VIN、FB、VOUT)以确认稳定性、过冲与环路响应。

七、采购与技术支持

作为拓尔微(TMI)系列产品,采购和量产前应索取并详读官方数据手册以获取完整引脚定义、电气特性曲线、典型性能图和参考 PCB 布局文件。若有特殊使用工况(极端温度、连续大电流或严格 EM C 要求),建议与供应商或厂商技术支持沟通验证。

总结:TMI3341 在体积、输入电压范围和中等电流输出之间提供良好的平衡,适合空间受限且需较高集成度的降压电源设计。正确的器件选型、元件搭配与 PCB 布局是实现高效率与稳定性的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.