WMSIC Electronic Components

TMI TMI5101

ModelTMI5101
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI5101
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI5101
Electronic Component
1
Package
SOT-23-5
Type
DC-DC
Electronic Component
LEDDriver
Electronic Component
PWM
Electronic Component
0.049g
Electronic Component
1
Channel Count
1
Features
(OVP); (OTP); (SCP)
Electronic Component
BM0230631098
Operating Temperature
40℃~+125℃
Switching Frequency
1.5MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI5101 产品概述

一、概述

TMI5101 是拓尔微(TMI)推出的一款高频率单通道降压稳压器,输入电压范围宽(DC 2.5V~5.5V),集成功率开关管,最高开关频率 1.5MHz,最大连续输出电流可达 1A。器件支持 PWM 调光,内部集成多重保护功能(过温保护 OTP、过压保护 OVP、短路保护 SCP),工作温度范围 -40℃~+125℃,采用经济型 SOT-23-5 封装,适合空间受限、对电磁兼容和外部元件数量有严格要求的便携与消费类电子应用。

二、主要特点

  • 输入电压:DC 2.5V~5.5V,适配锂电与 USB 电源系统
  • 1.5MHz 固定开关频率,支持小型外部电感与电容,降低占板面积
  • 单通道输出,最大输出电流 1A,内部集成开关管,简化外围设计
  • PWM 调光接口,适用于 LED 恒流/亮度控制场景
  • 全面保护:过温保护(OTP)、过压保护(OVP)、短路保护(SCP)
  • 工业温度级:-40℃~+125℃,可靠性高
  • 封装:SOT-23-5,适合批量生产和手工焊接

三、电气与性能参数(摘要)

  • 工作电压(VIN):2.5V~5.5V
  • 开关频率:1.5MHz(典型)
  • 输出电流:1A(最大连续)
  • 拓扑结构:降压(Buck),内部开关管
  • 调光方式:PWM 输入控制
  • 保护机制:OTP / OVP / SCP
  • 工作温度:-40℃~+125℃

四、典型应用场景

  • 手持设备与便携式产品的降压供电
  • LED 驱动与亮度 PWM 调节(低功耗背光、指示灯)
  • 微控制器与传感器供电模块(单节锂电供电)
  • USB 外围电源管理、便携式充电设备

五、设计与布局建议

  • 采用 1.5MHz 高频率时,可选小体积电感与陶瓷输出电容,注意 ESR 匹配以保持环路稳定。
  • 输入端需并联合适的旁路电容以抑制输入纹波;布线尽量缩短 VIN、GND、SW 回路,减小 EMI。
  • 开关节点(SW)及电感应远离敏感模拟电路,地线采用单点回流或局部接地以降低噪声耦合。
  • 热管理:SOT-23-5 封装热阻相对较高,注意铜箔面积扩展以利散热,保证在大电流工况下器件温升可控。

六、封装与可靠性

TMI5101 提供 SOT-23-5 小封装,适合空间受限设计。器件具备工业级温度范围和多重保护机制,适用于对可靠性要求较高的消费与工业电子产品。若有更详细的电气特性曲线、参考电路或 PCB 布局示意,请参考官方数据手册或联系拓尔微技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.