WMSIC Electronic Components

TMI TMI3493

ModelTMI3493
PackageSOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3493
Type
TMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3493
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.15g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258763891
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.3V~36V
Switching Frequency
75kHz~600kHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3493 产品概述

一、主要参数与功能概览

TMI3493 是一款降压型(Buck)同步整流开关稳压器,核心规格如下:输入电压范围 4.3V ~ 36V,连续输出电流可达 3A,开关频率可在 75kHz ~ 600kHz 范围内工作,工作结温范围 -40℃ ~ +125℃(TJ)。器件为单通道、降压拓扑,内部集成开关管(内置 MOSFET),静态工作电流仅约 1mA,输出为可调型,封装为 SOP-8。同步整流结构提高转换效率并降低外部肖特基需求。

二、性能亮点与系统优势

  • 宽输入电压范围覆盖常见汽车、工业与通信电源输入场景;内置开关管简化外部元件。
  • 同步整流带来更高效率,特别在中高负载时效率优势明显,有利于热管理。
  • 可调输出通过外部反馈电阻设定,适配多种输出电压需求;静态电流低,利于低功耗待机设计。
  • 可选的开关频率范围允许在效率、体积与噪声之间权衡:高频利于减小磁性元件尺寸,低频有利于提升效率和降低开关损耗。

三、典型应用场景

  • 工业控制与分布式电源模块
  • 汽车电子(符合输入电压范围前提)
  • 通信设备、路由器与机顶盒的点对点电源
  • 电池管理与便携式设备的中高功率降压

四、典型设计建议(布局与器件选择)

  • 输入/输出电容:优先低 ESR 的陶瓷电容,输入电容尽量靠近 VIN 与 GND 脚引脚,减小开关回路环路面积。
  • 电感:根据输出电流与占空比选择合适电流额定值与饱和电流裕量,频率高时可选体积更小的磁芯。
  • 输出取样:可调输出需通过外部电阻分压到 FB 引脚,布局尽量短且远离开关节点以保证精度。
  • 开关节点与回流回路:保持最短与最小回路面积,减小 EMI 与热损耗。
  • 保护与滤波:系统侧建议配置输入浪涌保护与输出滤波以提高可靠性。

五、热设计与封装注意

SOP-8 封装热阻相对中等,长时间 3A 输出时需关注封装温升与 PCB 散热,建议增加散热铜箔(下方与周围)并优化热过孔以提升导热。工作环境高温时应评估降额运行或采用散热措施。

六、系统级选型建议

在选型时结合系统输入电压、最大输出电流、允许的纹波与效率需求决定开关频率与电感尺寸;若需更高功率或更小封装,可考虑并联或替代器件。设计验证阶段进行热仿真与整机 EMI 测试,确保长期可靠性与性能稳定。

如需参考典型应用电路或 PCB 布局示意,可以提供具体输入/输出电压与负载条件,我可进一步给出元件选型与布局建议。

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