WMSIC Electronic Components

TMI TMI3344

ModelTMI3344
PackageESOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3344
Type
TMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3344
Electronic Component
1
Package
ESOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.18g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258503958
Operating Temperature
40℃~+150℃
Operating Voltage
4.5V~30V
Switching Frequency
340kHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3344 产品概述

一、产品简介

TMI3344 是拓尔微(TMI)推出的一款高集成度降压型开关稳压器,采用降压拓扑、内置开关管并实现同步整流,单通道可调输出,输出电流可达 3A。工作电压范围宽(4.5V~30V),开关频率固定在 340kHz,静态电流仅 380μA,适合对效率、体积和散热有较高要求的工业与汽车类应用。

二、主要特性

  • 宽输入电压:4.5V ~ 30V,兼容 12V、24V 系统及多数车用电源环境。
  • 输出能力:最大连续输出电流 3A,支持中等功率负载。
  • 同步整流:内部同步 MOSFET,减少整流损耗、提高系统效率。
  • 开关频率:340kHz,在效率与外部元件体积之间取得平衡。
  • 低静态电流:Iq = 380μA,有利于轻载或待机功耗控制。
  • 宽工作温度:-40℃ ~ +150℃,适应苛刻环境。
  • 封装:ESOP-8,便于焊接与热量传导。

三、电气规格与选型建议

  • 输出类型:可调,用户通过外部电阻分压设定目标电压。
  • 开关管:内置,简化外围电路,省去外部功率器件选型。
  • 外部元器件:建议选择低 DCR、大电流容量的电感(额定电流 > 3A,饱和电流裕量)、低 ESR 的陶瓷或固态电容作输出滤波。根据 340kHz 频率,典型电感量可在数 μH 范围内以兼顾纹波与瞬态响应。
  • 保护与容错:数据手册中若包含过流、过温、欠压锁定等保护特性,可进一步简化系统设计;如需更高可靠性,可配合外部保护电路。

四、典型应用

  • 工业控制与仪器电源(24V/12V 母线降压)
  • 汽车电子(符合宽电压输入与高温工作场景)
  • 网络设备、通信基站辅助电源
  • 工业 IoT、边缘计算模块电源

五、设计与 PCB 布局要点

  • 高电流回路尽量短且宽:VIN、SW、GND 的回流路径应最短,使用厚铜与多过孔散流。
  • 输入与输出电容靠近器件引脚放置,减少回路面积与电压尖峰。
  • 将反馈网络远离开关节点和噪声源,保证反馈采样精度。
  • 若出现 EMI 或振铃,可在开关节点增加 RC 阻尼或选用吸收元件。
  • 热设计:ESOP-8 需在 PCB 下方留焊盘并用多层铜通 via 导热至大面积地平面以利散热。

六、封装与热管理

ESOP-8 封装便于散热与自动化组装,但在高负载或高环境温度下仍需注意功耗分散。评估功率损耗(导通损耗 + 开关损耗)并在 PCB 设计中预留足够散热面积,必要时增加散热片或热 vias。

总结:TMI3344 以其宽输入、电流能力、同步整流与低静态电流特性,适合在体积受限且需高可靠性的场合作为主电源或局部降压电源。具体参数与应用细节建议参照官方数据手册进行最终设计验证。

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