WMSIC Electronic Components

TMI TMI6050-28 TMI6050

ModelTMI6050-28
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI6050-28
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
600mV@(600mA)
Electronic Component
TMI
Electronic Component
TMI6050-28
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.048g
Electronic Component
1
Features
Output
Electronic Component
BM0227749559
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
2.8V
Output Current
600mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI6050-28 产品概述

一、产品简介

TMI6050-28 是拓尔微(TMI)推出的一款高性价比、固定输出正向低压差线性稳压器(LDO),输出电压固定为 2.8V,最大输出电流可达 600mA。器件采用 SOT-23-5 小型封装,适合对体积、成本和散热有综合要求的便携与工业应用。典型静态电流仅 75µA,适合电池与低功耗系统供电管理。

二、主要特性

  • 输出类型:固定(2.8V)
  • 最大输出电流:600mA
  • 静态电流(Iq):75µA(典型)
  • 压差(Dropout):600mV @ 600mA
  • PSRR:60dB @ 1kHz(良好电源噪声抑制)
  • 内建短路保护、过流保护、过热保护
  • 带使能(EN)功能,可实现输出使能/关断
  • 工作结温范围:-40℃ ~ +125℃(Tj)
  • 封装:SOT-23-5

三、电气与热参数要点

  • 推荐最大输入电压:不超过 5.5V(请以完整数据手册为准)
  • 最低输入电压:应保证 VIN ≥ VOUT + Vdrop(在满载 600mA 时建议预留约 0.6V 余量)
  • 低待机电流,适合待机/休眠场景
  • 内部热关断与限流机制提高系统可靠性

四、封装与引脚(示意)

封装:SOT-23-5,适合自动贴装与批量生产。常见引脚功能(型号具体引脚排列请参考正式资料):

  • VIN:电源输入
  • VOUT:稳压输出(2.8V)
  • GND:地
  • EN:使能输入(高使能)
  • NC/ADJ:保留或空脚

在设计时务必参照厂方封装与引脚图,按规范焊盘与热散布局。

五、典型应用场景

  • 电池供电设备、便携式终端与手持仪器
  • 物联网节点、传感器前端与低功耗 MCU 供电
  • 工业控制模块、通信模块的低压稳压
  • 对噪声和稳定性有要求的模拟/混合信号电路

六、设计建议与注意事项

  • 输入/输出去耦:建议在 VIN 端和 VOUT 端分别放置低 ESR 陶瓷电容(常见 1µF~10µF,具体容量与 ESR 依数据手册要求选择),以保证稳定性与瞬态响应。
  • 留出压差余量:系统设计时需考虑压差随输出电流上升而增大,保证在最大负载下 VIN 足够。
  • 散热布局:SOT-23-5 封装受限于封装散热能力,建议使用较宽的地平面或热过孔以降低结温,避免长期满载导致热关断动作。
  • 布线:输入与输出电容尽量靠近芯片相应引脚放置,GND 引脚形成低阻抗回流路径。

七、保护功能说明

TMI6050-28 内置短路保护与过流限制,遇异常负载时自动限制输出电流以保护器件与负载;过热保护在结温超过安全值时关闭输出并在温度恢复后自动恢复,配合使能功能可实现可靠的系统级电源管理。

总结:TMI6050-28 以其低静态电流、良好 PSRR、完整的保护功能及小型封装,适用于对能耗、空间与可靠性有综合要求的电源管理场景。选型与电路设计时,请以厂方最新数据手册为准以获得完整电气特性曲线与布局建议。

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