WMSIC Electronic Components

TMI TMI6050-12 TMI6050

ModelTMI6050-12
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI6050-12
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI6050-12
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.049g
Electronic Component
1
Features
Output
Electronic Component
BM0228788382
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.2V
Output Current
600mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI6050-12 产品概述

TMI6050-12 是拓尔微推出的一款高可靠性、低噪声的固定输出线性稳压器(LDO),输出电压为 1.2V,最大输出电流 600mA。器件采用 SOT-23-5 封装,集成使能控制与多重保护机制,适合对电源稳定性和抗干扰要求较高的嵌入式与便携类应用。

一、主要特性

  • 固定输出:1.2V,正极输出,适合作为核心电压或敏感模拟供电。
  • 输出电流:最高 600mA,能满足中高功率需求的小型系统。
  • 供电范围:器件可在最高工作电压 5.5V 下稳定工作。
  • 低纹波抑制:PSRR 达 60dB(1kHz),对电源纹波与开关噪声有良好抑制能力。
  • 片内保护:具备短路保护、过流保护与过热保护,提升系统可靠性。
  • 使能控制:带 EN 引脚,支持电源使能、软启动或电源排序。
  • 宽温度范围:结温工作范围 -40°C ~ +125°C,适合工业级环境。

二、典型应用场景

  • MCU/FPGA/ASIC 的核心电源或内部模拟电源。
  • 移动终端与便携式设备电源管理。
  • 工业控制与通信设备中对低噪声电源的需求。
  • 传感器前端和精密模拟电路供电。

三、引脚与封装

  • 封装:SOT-23-5,体积小,便于 PCB 布局与空间受限设计。
  • 常用引脚:Vin、Vout、GND、EN(使能)、FB/ADJ(固定型可能为内部连接)。
  • 建议在 Vin 与 GND、Vout 与 GND 侧放置旁路电容并靠近引脚以减少寄生与振荡风险。

四、保护特性与热管理

器件内置短路和过流保护,可在异常负载条件下限制电流输出,并结合过热保护实现自动恢复。由于 SOT-23-5 封装散热受限,建议在 PCB 布局时增加过孔或铜箔散热区,合理评估功耗与温升,以确保在高负载下稳定工作。

五、应用建议

  • 输入/输出旁路:推荐使用低 ESR 陶瓷电容(例如 1µF~10µF)做输入与输出去耦,具体数值根据稳定性与瞬态响应调整。
  • 使能控制:EN 高电平使能,低电平关断,可做电源排序或待机控制。
  • PCB 布局:Vin、Vout、GND 区域应短路并保留充足铜箔,地线采用单点接地或良好回流路径以减小噪声耦合。
  • 热设计:在连续高负载场景下需考虑降压或增加散热面积以避免触发热关断。

六、订购与技术支持

TMI6050-12 由拓尔微(TMI)生产,SOT-23-5 封装适合批量贴装。详情可参考 datasheet 获取完整电气参数、典型应用电路与布局范例;如需样片、测试数据或技术支持,可联系拓尔微授权代理或销售工程师。

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