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TMI TMI3408F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI3408F
- Type
- TMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI3408F
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.047g
- Electronic Component
- 1
- Features
- Electronic Component
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0226613089
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 2.5V~5.5V
- Switching Frequency
- 1.5MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI3408F 产品概述
一、功能与主要规格
TMI3408F 是一颗降压型（Buck）DC-DC 开关稳压器，输入电压范围 2.5V～5.5V，输出可调 0.6V～5.5V，最大输出电流 1.2A，内部集成开关管并采用同步整流拓扑，开关频率 1.5MHz，静态电流仅 300µA，工作结温范围 -40℃～+125℃，封装为 SOT-23-5。该器件适合对体积、效率和待机功耗有综合要求的便携和电池供电设备。
二、性能亮点
- 同步整流提高轻载至重载效率，降低功耗和发热；
- 1.5MHz 高频率允许使用小体积电感与陶瓷电容，缩小外形尺寸；
- 低静态电流利于延长电池供电系统的待机时间；
- 输出电压可从 0.6V 精确设定至输入上限，适配多种负载需求。
三、封装与热管理
SOT-23-5 小封装适合高密度 PCB 设计，但散热能力有限。高电流或高压差场合需注意热沉与 PCB 铜箔面积扩展，通过加大 GND 与 VIN 路径的铜面积、放置过孔导热，保证器件在高温工况下稳定工作并适当降额运行。
四、外部元件建议
选择额定电流高于 1.2A 的低 DCR 高频电感（芯材适用于 1.5MHz），输出侧使用 X5R/X7R 陶瓷电容以保证低 ESR，输入侧放置适量陶瓷电容抑制开关噪声。反馈电阻器按所需输出电压计算并选用低温漂元件。由于为同步整流器，无需外接肖特基二极管。
五、PCB 布局要点
- 输入电容靠近 VIN 引脚，输出电容靠近开关与地；
- 电感、开关结点（SW）短路径布局，避免环路面积增大；
- 将热流集中到大地铜箔并使用多层过孔来提高散热；
- 反馈网络走线要远离噪声源，保证电压采样精度。
六、典型应用场景
适用于移动电源管理、便携式仪器、物联网终端、手持设备、模块化电源板等需要紧凑尺寸、高效率与低待机电流的场合。
七、设计注意事项
在设计前确认系统最大输入电压与输出功率条件，计算器件热耗并预留充分散热余量；选用低噪声布局以满足敏感模拟电路的 EMC 要求；实际样机需做负载、短路与瞬态响应测试，验证稳态与动态性能满足应用需求。
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