WMSIC Electronic Components

TMI TMI3112H

ModelTMI3112H
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3112H
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3112H
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.065g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226163270
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.7V~5.5V
Switching Frequency
2.3MHz
Electronic Component
Electronic Component
Output Voltage
600mV~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3112H 产品概述

一、概述

TMI3112H 是拓尔微(TMI)推出的一款高集成、低功耗同步整流降压(Buck)型 DC-DC 转换芯片,封装为 SOT-23-5。芯片内部集成高侧与低侧功率开关,支持可调输出电压,输入电压范围 2.7V ~ 5.5V,输出电压可设定在 0.6V ~ 5.5V,最大输出电流 2A,开关频率高达 2.3MHz,工作结温范围 -40℃ ~ +125℃(TJ)。静态待机电流仅 40μA,适合对能耗敏感的便携与电池供电场景。

二、主要特性

  • 输入电压:2.7V ~ 5.5V,支持常见单节/双节锂电与 5V 输入系统。
  • 输出电压:可调,参考内置基准 0.6V(Vref),可通过反馈电阻网络精确设定。
  • 输出电流:最高 2A,适合中等功率负载。
  • 同步整流:集成低导通损耗同步 MOSFET,提高转换效率、减小发热。
  • 高频工作:典型开关频率 2.3MHz,可显著减小电感与电容体积,利于小型化设计。
  • 低静态电流:Iq = 40μA,有利于延长电池待机时间。
  • 封装:SOT-23-5,适合小尺寸 PCB 布局与手持设备应用。

三、典型电气设计参数

  • 基本调节公式:VOUT = VREF × (1 + R1/R2),其中 VREF ≈ 0.6V。
  • 高频工作带来的优点是外围被动元件体积小,但在高负载/高 Vin 情况下开关损耗与热量需关注,效率随负载、输入电压而变化。
    (注:具体效率曲线与热特性请参考芯片详细数据手册与评估板测量)

四、外围器件建议与设计要点

  • 电感:建议选择低 DCR、低直流饱和的功率电感。由于 2.3MHz 高频,可选较小电感值(例如 0.47μH ~ 2.2μH,具体值根据纹波、效率与占空比优化)。
  • 输入电容:靠近芯片 VIN 引脚放置 10μF(或更高)的低 ESR 陶瓷电容,保证瞬态供电与抑制输入电压纹波。
  • 输出电容:使用多颗陶瓷电容并联(例如 22μF 陶瓷为起点),兼顾纹波、稳定性与瞬态响应。
  • 反馈网络:使用精度中等的电阻,R1+R2 阻值不宜过大以避免噪声敏感,也不宜过小以免增加静态电流。通常反馈分压阻值总和在几十 kΩ 量级常见。
  • 旁路与滤波:若接口对 EMI 敏感,可在输入侧增加小电阻或阻容滤波,但要控制功率损耗与稳定性影响。

五、PCB 布局与热管理注意事项

  • 将输入电容紧贴 VIN 与 GND 引脚放置,减小回流环路面积。
  • 将输出电容与电感尽量靠近 SW 节点与输出引脚布局,缩短高 di/dt 回路路径。
  • 将反馈引脚走短且远离开关节点和噪声源,使用地平面并保证良好接地。
  • SOT-23-5 封装散热能力有限,高输出电流或高 Vin 下需评估结温,必要时在 PCB 上增加铜厚或铜面积作为散热路径,并在设计中考虑热降额。

六、典型应用场景

  • 智能穿戴、便携式设备与 IoT 终端,因其低静态电流与小体积特性非常适合。
  • 便携仪器、便携式显示与传感节点的局部电源。
  • 消费电子与工业小功率点对点供电场合,需要 2A 左右输出且要求体积小、效率高的场合。

七、选型与使用建议

在选型与系统设计时,建议参考官方数据手册获取详尽的引脚定义、典型效率曲线、热阻参数与建议参考电路。对于要求更高的连续 2A 输出,请在典型工况下做热仿真与样机测试,评估 PCB 散热与效率,在高温或大功率工作点做好降额设计。

总结:TMI3112H 以高开关频率、低静态电流与同步整流设计,提供了一种适合小型化、低功耗、2A 级别降压解决方案。通过恰当的磁性元件选择与良好的 PCB 布局,可在便携与嵌入式电源设计中获得较好的性能与可靠性。

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