WMSIC Electronic Components

TMI TMI3181A

ModelTMI3181A
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 171151

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3181A
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3181A
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.1g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258874035
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~6.5V
Switching Frequency
1.2MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3181A 产品概述

一、产品简介

TMI3181A 是拓尔微(TMI)推出的一款高集成度降压型开关稳压器,输入电压范围2.5V至6.5V,输出可调范围0.6V至6.5V,最高输出电流800mA。器件采用降压拓扑并内置开关管与同步整流,开关频率1.2MHz,静态电流仅3µA,工作结温范围为-40℃至+125℃,封装为SOT-23-5,适合空间受限且对电源效率有较高要求的便携与嵌入式应用。

二、主要特点

  • 输入电压:2.5V~6.5V,支持单节至多节电池或5V供电系统。
  • 输出电压:0.6V~6.5V 可调,灵活配置多种负载供电电压。
  • 输出电流:最高800mA,适合中等负载设备。
  • 同步整流:内置同步整流提高效率,降低导通损耗,特别在中高负载下优势明显。
  • 高频率:1.2MHz 开关频率,利于使用小体积电感与陶瓷电容,减小整体尺寸。
  • 低静态电流:Iq≈3µA,有利于电池待机寿命优化。
  • 封装:SOT-23-5,便于小型化PCB设计与批量生产。

三、电路设计要点

  • 输入与输出电容应选用低ESR陶瓷电容,靠近器件布置,以抑制瞬态与开关噪声。
  • 电感选择:优先选用能满足800mA连续电流且具有低直流电阻(DCR)的封装电感;频率1.2MHz允许选择较小的体积,提高布局密度。
  • PCB布局:电源回路(开关节点、输入电容、二极管/同步MOS管寄生回路)应缩短并集中,地线采用大面积回流层以降低热阻与噪声。
  • 热管理:SOT-23-5 封装热阻较高,连续大电流输出时需保证良好散热,建议增加铜箔面积并靠近器件做热过孔。
  • 保护与启动:实际系统中应考虑输入欠压、过流与短路保护以及合适的软启动或上电顺序策略,以保护负载与延长可靠性。

四、典型应用场景

  • 便携式与电池供电设备(手持终端、智能传感器、可穿戴设备)
  • 嵌入式系统的主电源或子电源(MCU、无线模块、传感器供电)
  • 工业控制与自动化中对体积和效率有要求的点位电源
  • 5V/3.3V等常见电压转换场合,尤其在空间与待机能耗受限时更具优势

五、封装与热设计建议

SOT-23-5 封装便于小型化设计,但散热能力有限。建议在器件下方与周边采用大面积铜箔并连至多层电源地,必要时增加热过孔直通内层或底层铜箔以提升导热性能,确保在高环境温度或持续大电流输出工况下器件工作在安全结温范围内。

总结:TMI3181A 以高开关频率、低静态电流与同步整流为主要优势,适合对尺寸、效率与待机耗电有要求的中小功率降压场合。设计时关注布局与热管理可获得最佳性能与可靠性。

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