WMSIC Electronic Components

TDD S5MC

ModelS5MC
PackageSMC
BrandTDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 171404

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
TDD S5MC
Type
TDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TDD
Electronic Component
S5MC
Electronic Component
1
Package
SMC
Electronic Component
0.32g
Electronic Component
1
Electronic Component
BM0266040362
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S5MC整流二极管产品概述

一、产品定位与核心应用

S5MC是台冠电子(TDD)针对中功率整流场景推出的表面贴装器件,属于通用型整流二极管范畴。其设计核心是满足工业控制、电源转换、新能源等领域对「5A级平均电流、1kV级反向耐压」的整流需求,兼顾效率与可靠性,可替代同规格插件/贴片器件,适配自动化生产与高密度PCB设计。

二、关键性能参数解析

S5MC的参数特性直接支撑其场景适配性,核心指标如下:

  1. 低导通损耗:正向压降Vf仅1V(@5A典型电流),比同规格竞品低约17%,导通损耗显著降低,有助于提升电源转换效率,减少散热需求。
  2. 中高压阻断能力:直流反向耐压Vr达1kV,可覆盖220V/380V交流系统(预留安全裕量后),满足工业电网的电压等级要求。
  3. 抗浪涌与额定电流:平均整流电流5A,稳定承载连续工作电流;非重复峰值浪涌电流Ifsm达150A(8.3ms半波冲击),能有效应对电机启动、开关切换等瞬间大电流冲击,提升系统可靠性。
  4. 低反向漏电流:反向电流Ir仅5μA(@25℃、1kV反向电压),漏电流小意味着反向阻断时损耗低、发热少,长期工作稳定性优异。
  5. 宽温适应性:工作结温覆盖-55℃至+150℃,可适应工业环境的极端温度变化(如车间冬夏温差),无需额外温控措施即可稳定运行。

三、封装与可靠性设计

S5MC采用SMC表面贴装封装,具备以下设计优势:

  1. 小型化与自动化适配:封装尺寸紧凑(约2.9×3.8×1.8mm),比传统插件封装节省60%以上PCB空间,适合高密度电路;兼容回流焊、波峰焊等自动化工艺,提升生产效率。
  2. 散热与环境耐受性:封装采用高导热塑料+金属引脚,引脚设计兼顾散热传导,可将热量有效传递至PCB铜箔;材料耐潮、抗腐蚀,符合工业级可靠性标准(J-STD-020湿度敏感度1级)。

四、典型应用场景推荐

S5MC的参数特性使其适用于以下核心场景:

  1. 中功率开关电源:200W-500W AC-DC电源的全桥整流单管,低Vf提升效率,抗浪涌应对开机冲击。
  2. 电机驱动电路:无刷直流电机、伺服电机的整流模块,150A浪涌能力承受启动峰值电流,宽温适应车间环境。
  3. 光伏/储能逆变器:DC侧预整流或AC侧辅助整流,1kV耐压适配光伏组件串高压输出,宽温满足户外安装。
  4. 工业控制设备:PLC、变频器、伺服系统的电源模块,稳定承载5A连续电流,宽温适应现场温度波动。
  5. 医疗设备电源:部分中功率医疗设备(如理疗仪)的整流电路,低漏电流与高可靠性符合安全要求。

五、选型与使用注意事项

为确保稳定工作,需注意以下要点:

  1. 参数匹配:平均电流≤5A,反向电压峰值≤1kV(预留20%裕量),非重复浪涌≤150A(8.3ms)。
  2. 散热设计:5A连续工作时,PCB需预留≥10cm²铜箔面积,或加装小型散热片,避免结温超150℃。
  3. 焊接工艺:回流焊峰值温度≤260℃(时间≤30s),波峰焊温度≤245℃(时间≤5s),防止高温损坏。
  4. 存储运输:存储温度-40℃~+85℃,湿度≤85%;运输需防静电、防震动(用防静电包装)。
  5. 尖峰防护:若存在电压尖峰,需并联压敏电阻或TVS二极管,避免反向击穿。

S5MC以「高性价比+工业级可靠性」成为中功率整流场景的优选器件,可覆盖多数常规工业与电源应用的需求。

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