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TDD S3MC
Configuration
1 options
Configuration
Option 171419
Available for RFQ
Technical data
Product details
13
specifications
Core information
- Product name
- TDD S3MC
- Type
- TDD
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDD
- Electronic Component
- S3MC
- Electronic Component
- 1
- Package
- SMC
- Electronic Component
- 0.32g
- Electronic Component
- 1
- Electronic Component
- BM0266040801
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TDD S3MC 1kV/3A 整流二极管产品概述
一、产品基础信息
这款由台冠电子（TDD）推出的S3MC整流二极管，采用SMC贴片封装（对应国际标准DO-214AB），是针对小型化、高压整流场景设计的高效器件。SMC封装以体积紧凑、焊接便捷为核心特点，尺寸仅约4.0×2.5×1.5mm，能大幅节省PCB空间，适配各类紧凑型电子设备。
二、核心电性能参数及实际价值
S3MC的参数针对性强，兼顾高压耐受与低损耗需求，关键性能解析如下：
- 正向压降（Vf）：1V@3A：导通时压降仅1V，3A平均负载下导通功耗仅3W，比同规格竞品（1.1-1.2V）低10%以上，可减少散热需求、提升电源效率。
- 直流反向耐压（Vr）：1kV：额定反向耐压1000V，满足110V/220V AC转高压DC的初级整流等场景，设计留20%余量即可覆盖实际工况。
- 平均正向电流（If）：3A：持续工作额定电流，适配小型快充适配器、LED驱动电源等3A以内负载。
- 反向漏电流（Ir）：5μA@1000V：反向漏电流极小，1kV电压下仅5微安，降低反向功耗、延长寿命；125℃高温下漏电流增长缓慢（≤20μA），可靠性更高。
- 非重复峰值浪涌电流（Ifsm）：100A：能承受开机电容充电等瞬间100A浪涌，无需额外增加大容量防护器件，简化系统设计。
- 工作结温范围：-55℃~+150℃：宽温覆盖工业级环境（-40℃~+85℃）及极端场景（如户外电源、低温设备）。
三、封装与典型应用场景
SMC封装的优势让S3MC适配多种场景：
- 封装特点：贴片无引脚设计，支持回流焊、波峰焊，焊接效率高；小体积适合高密度PCB（如手机充电器、智能音箱电源）。
- 典型应用：
- 小型AC-DC适配器（5V/3A、9V/2A快充）；
- LED驱动电源（12串LED恒流驱动等高压小功率场景）；
- 工业控制模块（低压差整流、信号整流）；
- 家电控制板（智能电饭煲、加湿器电源整流）。
四、设计与使用注意事项
为确保稳定工作，需注意以下几点：
- 降额设计：实际平均电流建议≤2.5A（降额20%），反向电压≤800V，避免长期过载。
- 散热优化：环境温度超85℃时，需扩展PCB焊盘铜箔面积（≥10mm²），或配合小型散热片，避免结温超150℃。
- 浪涌防护：虽能承受100A浪涌，系统级仍建议并联600V/500W TVS管，双重防护更可靠。
- 焊接工艺：回流焊峰值温度≤260℃，焊接时间≤10秒，避免过热损坏。
这款TDD S3MC凭借平衡的电性能、小型化封装及高可靠性，成为替代传统插件整流管（如1N5408）的理想选择，尤其适合对体积、效率有要求的电子设备。
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