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UNI-ROYAL 0805W8F1003T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F1003T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F1003T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.031g
- Electronic Component
- 100kΩ
- Electronic Component
- 1
- Electronic Component
- BM0228745294
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F1003T5E 产品概述
一、产品简介
0805W8F1003T5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装规格为 0805（2.0 mm × 1.25 mm），阻值 100 kΩ（代码 1003），额定功率 125 mW，公差 ±1%。本产品针对中高密度表面贴装电路设计，兼顾体积、小信号稳定性与制造可焊性，适用于各类消费电子、通信与工业控制产品中的分压、偏置与滤波电路。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：100 kΩ（1003）
- 公差：±1%
- 额定功率：125 mW（在规定环境温度下）
- 最大工作电压：150 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55 ℃ ~ +155 ℃
- 封装：0805（2.0 mm × 1.25 mm）
- 品牌：UNI-ROYAL（厚声）
三、结构与封装
本款为厚膜工艺制程，电阻体由高稳定性的金属氧化物浆料印刷并烧结而成，两端以电极金属化并覆以耐焊接层，适配常见 SMT 流水线。0805 尺寸在板级布局中兼具空间效率与可焊性，适合手工调试与自动贴装。常见供货形式为卷带包装，便于 SMT 生产线直接上料。
四、性能与可靠性
厚膜材料提供良好的长期稳定性和抗潮湿能力，±1% 的公差和 ±100 ppm/℃ 的 TCR 能满足对精度与温漂有一定要求的电路。125 mW 的功率额定在常温下可满足大多数偏置与分压应用；为保证可靠性，应注意功率随环境温度上升而降额（建议按厂商提供的降额曲线在高温下使用）。额定工作电压 150 V 适用于较高电位差应用场合。产品适配无铅回流焊工艺，耐受常规回流温度峰值（具体请参考工艺曲线）。
五、典型应用场景
- 精密分压与参考电路
- 模拟前端偏置、输入阻抗匹配
- 滤波器、RC 延时网络
- 工业控制、测量仪表中的取样电阻
- 通信设备与消费电子的阻值网络
六、安装与焊接建议
- 推荐采用符合 IPC 标准的回流焊工艺，峰值温度与时间应参照无铅元件规范（常见峰值 ≤ 260 ℃）。
- 贴装过程中避免施加过大弯曲或机械应力，以免导致电极裂纹或焊点劣化。
- 对于高功率或高环境温度场合，建议在 PCB 设计中预留散热与热隔离空间，并按降额曲线选择合适的器件功率裕度。
- 存储应避免潮湿与长时间暴露于腐蚀性气体；开封后尽量短期内使用，或按干燥箱/干燥包装规范保存。
七、订购与包装信息
产品型号：0805W8F1003T5E（UNI-ROYAL）
常见包装：卷带（Tape & Reel），量大可按客户要求提供轴装或切带包装。订购时请确认阻值、精度、包装规格与交货期，以便生产与配套测试。
如需详细的热降额曲线、回流焊温度曲线或可靠性测试报告，请提供采购数量或联系技术支持以获取完整技术资料。
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