Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 4D03WGJ0472T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 4D03WGJ0472T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 4D03WGJ0472T5E
- Electronic Component
- 1
- Package
- 0603x4
- Electronic Component
- Resistor Array
- Electronic Component
- ±5%
- Electronic Component
- 0.029g
- Electronic Component
- 4.7kΩ
- Electronic Component
- 8
- Electronic Component
- 1
- Electronic Component
- BM0257245643
- Electronic Component
- ±200ppm/℃
- Resistor
- 4
- Power
- 62.5mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
4D03WGJ0472T5E 产品概述
一、产品简介
4D03WGJ0472T5E 是 UNI-ROYAL（厚声）推出的一款四路排阻网络，标称阻值为 4.7kΩ，单元阻值精度 ±5%，每通道额定功率 62.5mW，温度系数 TCR ±200ppm/℃，封装形式为 0603x4，封装引脚数 8。该器件将四个尺寸为 0603 的薄膜/厚膜电阻集成在一个 8 引脚封装中，适合占空间受限的表面贴装电路。
二、主要参数
- 阻值：4.7kΩ（每路）
- 精度：±5%（每路）
- 单路额定功率：62.5mW
- 温度系数：±200ppm/℃
- 引脚数：8（四路独立）
- 封装：0603x4（四颗 0603 电阻集合）
- 品牌：UNI-ROYAL（厚声）
三、结构与封装说明
0603x4 常见为四个 0603 电阻并列封装，采用标准 8 引脚布局，每个电阻两端对应两个引脚，通常为独立隔离通道（非公共端类型）。小型化封装便于在高密度 PCB 上布置，适合自动贴装与回流焊工艺。
四、性能特点
- 小体积、可节省 PCB 空间；
- 统一制造、阻值一致性好，便于批量布线与测试；
- 额定功率为 62.5mW，适合低功耗信号和偏置用途；
- ±200ppm/℃ 的温漂属于中等水平，适合一般环境温度变化下的应用；
- ±5% 精度适合通用级电子设计，但不适合高精度测量场合。
五、典型应用场景
- 拉/下拉电阻阵列（MCU、逻辑门）
- 阻抗匹配与限流（低电流的信号线）
- 模拟开关阵列、按键矩阵、传感器前端偏置
- 消费电子、物联网终端、便携设备等对体积敏感的场合
六、选型与使用建议
- 计算功耗时按 P=V²/R 估算，单元 62.5mW 表明不能用于高压大电流场合，推荐留有功率裕度（常取额定值的 50% 以下以提高可靠性）；
- 对温漂和长期稳定性有较高要求的场合，考虑使用更低 TCR 或更高精度的器件；
- 焊接采用厂商推荐的回流曲线，注意湿敏等级与烘箱预处理以避免焊接缺陷；
- PCB 布局尽量缩短引脚到器件的走线，避免热源附近布放，以降低热漂与功率累积。
七、可靠性与存储
按一般 SMD 元器件管理，保持干燥包装，避免潮湿环境长时间暴露；长期储存与高温、高湿环境会影响焊接性与电阻稳定性。具体可靠性指标（如寿命、湿热、振动）请参考 UNI-ROYAL 官方数据手册。
总结：4D03WGJ0472T5E 是面向通用电子设计的四路排阻解决方案，具有体积小、便于批量贴装的优势，适合用于低功耗信号偏置与拉/下拉场景。在选型时需关注功率余量与温漂要求，以确保长期稳定运行。若需更高精度或更大功率，请参考厂方同系列或替代型号。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
