WMSIC Electronic Components

UNI-ROYAL 0805W8F2000T5E

Model0805W8F2000T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F2000T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F2000T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
200Ω
Electronic Component
1
Electronic Component
BM0257245277
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F2000T5E 产品概述

一 产品概述

0805W8F2000T5E 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装为 0805(2.0 mm × 1.25 mm)。该型号阻值为 200 Ω,精度 ±1%,额定功率 125 mW,额定工作电压 150 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该产品定位于中高可靠性、通用型表面贴装电阻,适用于空间受限且要求稳定阻值的电子设备。

二 主要参数

  • 阻值:200 Ω
  • 精度:±1%(F)
  • 功率:125 mW
  • 最大工作电压:150 V
  • 温度系数:±100 ppm/℃
  • 工作温度:-55℃ 至 +155℃
  • 电阻类型:厚膜(Film)
  • 封装:0805(2.0 × 1.25 mm)
  • 品牌:UNI-ROYAL(厚声)

三 特点与优势

  • 稳定性良好:厚膜制造工艺在常规温湿度及热循环下表现出稳定的阻值特性,适合中低频应用。
  • 精度较高:±1% 精度适用于要求较高的分压、偏置网络与模拟前端电路。
  • 宽温度适应性:-55℃ 到 +155℃ 的工作温度范围覆盖汽车电子、工业控制等严苛环境的基本需求(实际可靠性需参照厂方试验数据)。
  • 良好的封装兼容性:0805 尺寸广泛兼容自动贴装与回流焊工艺,便于量产装配。
  • 电压与功率匹配:150 V 的最大工作电压与 125 mW 的功率等级适合中低功率信号路径或功率受限的电路节点。

四 典型应用场景

  • 消费电子:滤波、分压、偏置和阻抗匹配电路。
  • 工业控制:传感器接口、信号调理与去耦网络(按降额使用)。
  • 通信设备:阻抗调整与偏置网络,适用高密度 SMT 板。
  • 仪器仪表:温度补偿、参考电路中的精密分流(受限于功率要求)。

五 设计与装配建议

  • 功率与降额:标称 125 mW 为在特定环境与温度下的额定值,实际电路设计中应根据环境温度和散热条件采用降额策略,避免长期满载工作。
  • 电压限制:使用时严禁超过额定最大工作电压 150 V,以防电阻击穿或发热异常。
  • 焊接兼容性:该厚膜贴片电阻适用于常见的回流焊工艺。具体回流温度曲线建议参照 UNI-ROYAL 官方资料或行业 IPC/JEDEC 标准执行,以保证可靠性与焊点质量。
  • 机械应力:贴片电阻对焊盘设计和清洗工艺敏感,避免由于焊盘尺寸、焊膏量或清洗不当引起的应力导致裂纹或性能退化。

六 贮存与可靠性

  • 贮存环境:建议在干燥、无腐蚀性气体的环境中保存,避免高温高湿与阳光直射。
  • 防潮处理:若长期贮存或经过潮湿环境,应按厂方说明进行回流前的预烘烤或干燥处理(参照制造商建议)。
  • 可靠性验证:在关键应用中,建议根据应用场景进行加速寿命试验(如热循环、湿热、机械振动)以验证在目标环境下的寿命与漂移特性。

七 选型注意事项

  • 若电路有较大瞬态电压或冲击,请确认电阻的脉冲承受能力并考虑增加吸收/限流元件。
  • 对于更高精度或更低温漂的场合,可考虑金属膜或薄膜电阻产品;若功率需求高于 125 mW,应选择更高功率等级或更大封装。
  • 在量产前,建议向供应商索取详细数据手册(含温漂曲线、功率降额曲线、回流工艺参数及可靠性试验报告),以便进行最终验证与改型确认。

如需产品数据手册(Datasheet)、样品或卷带包装信息,我可以帮助整理向 UNI-ROYAL 查询的要点或生成标准的询价清单。

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