WMSIC Electronic Components

UNI-ROYAL 0805W8F3300T5E

Model0805W8F3300T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F3300T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F3300T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
330Ω
Electronic Component
1
Electronic Component
BM0257245033
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F3300T5E 产品概述

一、产品简介

0805W8F3300T5E 为 UNI-ROYAL(厚声)系列贴片厚膜电阻,封装为0805(公制2012)。标称阻值为 330Ω,阻值精度 ±1%,额定功率 125mW,工作电压 150V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ 至 +155℃。该型号面向体积受限的表贴电路,兼顾精度和成本,适用于一般电子产品的分压、限流和偏置网络。

二、主要规格与电气性能

  • 阻值:330Ω(E24/E96系列中的精密选择)
  • 精度:±1%
  • 额定功率:125mW(额定环境温度条件下)
  • 最大工作电压:150V(或按I²R限制)
  • 温度系数:±100ppm/℃,适合对温漂有一定要求的应用
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0805 SMD(尺寸约 2.0mm × 1.25mm)

三、特点与优势

  • 高可靠性:厚膜工艺成熟,对冲击、振动和焊接热循环有良好抗性。
  • 精度较高:±1% 精度适合对阻值稳定性有要求的电路设计。
  • 宽温度范围:-55℃ 至 +155℃,可在工业级温度环境下使用。
  • 小型封装:0805 既能节省PCB面积,又便于自动贴片和回流焊工艺。
  • 成本效益高:厚膜电阻在中低功率和大批量应用中具有优越的成本优势。

四、典型应用场景

  • 信号处理与滤波网络中的分阻与阻抗匹配
  • 电源管理和偏置电路的限流/分压元件
  • 工业控制、通信设备、汽车电子(非关键安全位置)以及消费电子产品
  • 需要批量贴装、对成本与稳定性有均衡要求的系统

五、装配与使用建议

  • 建议按常规回流焊工艺处理,遵循制造商推荐的回流曲线(Pb-free 260℃峰值常见),避免超温或重复高温循环以防性能退化。
  • 在高温环境使用时应考虑功率降额(derating),通常从额定环境(如 70℃)开始线性降额,接近最高工作温度时应限制实际耗散功率以保证寿命。
  • 设计 PCB 时留意焊盘尺寸与热扩散,避免过度散热导致器件应力或不均匀焊接。
  • 在高精度或低噪声要求的场合,配合合适的搭配电阻与补偿措施以降低温漂影响。

六、可靠性与贮存

  • 常见可靠性测试包括耐焊接热、热冲击、温度循环、高/低温储存和湿热试验,厚膜电阻在这些试验中表现良好。
  • 贮存时应避免潮湿、高温与污染,未拆封状态下按厂商建议的保质期和条件保存;开封后建议尽快使用以减少受潮或锡膏污染的风险。

如需样品、详细数据手册(含阻值表、机械尺寸、回流曲线与可靠性试验结果)、或在特定应用中的等效替代建议,可提供更详尽的技术支持与选型对比。

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