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UNI-ROYAL 4D02WGJ0330TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 4D02WGJ0330TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 4D02WGJ0330TCE
- Electronic Component
- 1
- Package
- 0402x4
- Electronic Component
- Resistor Array
- Electronic Component
- ±5%
- Electronic Component
- 0.012g
- Electronic Component
- 33Ω
- Electronic Component
- 8
- Electronic Component
- 1
- Electronic Component
- BM0140252997
- Electronic Component
- ±200ppm/℃
- Resistor
- 4
- Power
- 62.5mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述: 4D02WGJ0330TCE
1. 产品简介
4D02WGJ0330TCE是一款高品质的表面贴装（SMD）排阻，由知名品牌UNI-ROYAL（厚声）生产。产品的规格为33Ω阻值，功率额定值为62.5mW，公差为±5%。该排阻采用0402（1.0mm x 0.5mm）封装，能够满足高密度电路板设计的需求，适用于自动化组装工艺。
2. 技术参数
- 阻值：33Ω
- 功率额定值：62.5mW
- 公差：±5%
- 封装尺寸：0402 (2.0mm x 1.0mm)
- 品牌：UNI-ROYAL（厚声）
- 电气特性：低噪声、高稳定性
3. 应用领域
4D02WGJ0330TCE排阻广泛应用于各类电子设备中，包括但不限于：
- 消费电子：如智能手机、平板电脑、笔记本电脑等。
- 工业设备：控制面板、传感器、电机驱动等自动化设备。
- 通信设备：路由器、基站及其他网络通信设备。
- 医疗器械：用于监测和测量的电子设备。
由于其小巧的0402封装尺寸，4D02WGJ0330TCE特别适合需要高集成度和小型化设计的现代电子产品。
4. 性能特点
- 小型化设计：0402封装使其非常适合高密度布线的印刷电路板(PCB)。
- 低功耗：62.5mW的功率额定使其在低功耗应用中表现出色，有助于延长电子设备的电池寿命。
- 高稳定性：为确保长时间的可靠运行，该产品在温度变化和湿度变化等环境因素下保持良好的性能。
- 较低热积聚：高效的热管理能力，适用于需要稳定电流和电压的电路设计。
5. 设计考虑
在使用4D02WGJ0330TCE排阻时，设计师需要考虑几个关键因素：
- 安装方式：由于其SMD特性，要求利用适当的贴片技术进行良好的焊接。在焊接过程中应特别注意焊接温度和时间，以避免损坏元件。
- 负载能力：尽管该排阻的额定功率为62.5mW，但实际应用中应根据电路设计合理选择工作条件，以确保不超过额定负载。
- 环境保护：在湿度和温度变化较大的环境中使用时，应考虑采用额外的保护措施，确保长期稳定性。
6. 结论
综上所述，4D02WGJ0330TCE是一款具有优秀性能的小型排阻，适用于多种电子应用。UNI-ROYAL（厚声）作为知名品牌，其所提供的产品质量可靠，性能稳定，非常适合在现代电子设计中使用。无论是在高密度电路板设计、低功耗电子产品，还是在需要高可靠性的工业设备中，4D02WGJ0330TCE均能提供理想的解决方案，为设计师开辟了更广泛的应用前景。
选择4D02WGJ0330TCE排阻，您将获得一个从性能、稳定性到尺寸设计都满足现代需求的优质元件，助力您的产品在激烈的市场竞争中保持领先。
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